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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-064-10-051101

510-83-064-10-051101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

 3050
- +

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 510-83-064-10-051101

Datasheet

 Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-43-116-41-013000

346-43-116-41-013000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.

 2252
- +

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 346-43-116-41-013000

Datasheet

 Bulk 346 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-096-14-091101

510-87-096-14-091101

CONN SOCKET PGA 96POS GOLD

Preci-Dip

 2111
- +

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 510-87-096-14-091101

Datasheet

 Bulk 510 Active PGA 96 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-003101

116-87-642-41-003101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

 3799
- +

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 116-87-642-41-003101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3513-11

14-3513-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 2663
- +

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 14-3513-11

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-83-316-11-001101

299-83-316-11-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

 3916
- +

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 299-83-316-11-001101

Datasheet

 Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-636-41-001101

614-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

 3589
- +

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 614-83-636-41-001101

Datasheet

 Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-628-41-001101

122-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

 2201
- +

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 122-83-628-41-001101

Datasheet

 Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-628-41-001101

123-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

 2235
- +

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 123-83-628-41-001101

Datasheet

 Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
19-0513-10

19-0513-10

CONN SOCKET SIP 19POS GOLD

Aries Electronics

 2574
- +

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 19-0513-10

Datasheet

 Bulk 0513 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0513-10T

21-0513-10T

CONN SOCKET SIP 21POS GOLD

Aries Electronics

 2163
- +

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 21-0513-10T

Datasheet

 Bulk 0513 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10

27-0518-10

CONN SOCKET SIP 27POS GOLD

Aries Electronics

 3092
- +

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 27-0518-10

Datasheet

 Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-87-668-41-005101

117-87-668-41-005101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip

 2974
- +

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 117-87-668-41-005101

Datasheet

 Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-097-14-091101

510-87-097-14-091101

CONN SOCKET PGA 97POS GOLD

Preci-Dip

 3591
- +

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 510-87-097-14-091101

Datasheet

 Bulk 510 Active PGA 97 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-065-10-051101

510-83-065-10-051101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

 3033
- +

Add To Cart

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 510-83-065-10-051101

Datasheet

 Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-065-10-052101

510-83-065-10-052101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

 2394
- +

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 510-83-065-10-052101

Datasheet

 Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-002101

116-87-632-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

 2871
- +

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 116-87-632-41-002101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-13-063101

510-87-100-13-063101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

 3172
- +

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 510-87-100-13-063101

Datasheet

 Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-13-064101

510-87-100-13-064101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

 3247
- +

Add To Cart

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 510-87-100-13-064101

Datasheet

 Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-105191

110-87-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

 2721
- +

Add To Cart

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 Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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