Sockets for ICs, Transistors - Shenzhen Taoxiong (TX) Electronics Co., Ltd.

SHOPPING CART

View All >>

Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
116-83-328-41-011101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2382	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3518-10H CONN IC DIP SOCKET 20POS GOLD Aries Electronics	2030	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-145-15-081101 CONN SOCKET PGA 145POS GOLD Preci-Dip	3008	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	145 (15 x 15)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-17-001101 CONN SOCKET PGA 145POS GOLD Preci-Dip	2947	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	145 (17 x 17)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-624-SST CONN IC DIP SOCKET 24POS GOLD Samtec Inc.	3710	- + Add To Cart Inquiry Now	Datasheet	Tube	ICO	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
116-87-636-41-011101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3711	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-002101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3426	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-2811-N CONN IC DIP SOCKET 28POS GOLD Omron Electronics Inc-EMC Div	3998	- + Add To Cart Inquiry Now	Datasheet	Bulk	XR2	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
08-3501-20 CONN IC DIP SOCKET 8POS TIN Aries Electronics	3709	- + Add To Cart Inquiry Now	Datasheet	Bulk	501	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
08-3501-30 CONN IC DIP SOCKET 8POS TIN Aries Electronics	2551	- + Add To Cart Inquiry Now	Datasheet	Bulk	501	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-11 CONN SOCKET SIP 25POS GOLD Aries Electronics	3629	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-432-41-009101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	2492	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-001101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3573	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-001101 CONN SOCKET PGA 85POS GOLD Preci-Dip	2391	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	85 (13 x 13)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-042101 CONN SOCKET PGA 85POS GOLD Preci-Dip	3234	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	85 (13 x 13)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-081101 CONN SOCKET PGA 85POS GOLD Preci-Dip	2998	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	85 (13 x 13)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-448-41-105101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	3288	- + Add To Cart Inquiry Now	Datasheet	Bulk	117	Active	DIP, 0.4 (10.16mm) Row Spacing	48 (2 x 24)	0.070 (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-008101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	3445	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-6503-20 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	3363	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.6 (15.24mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
06-6503-30 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	2479	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.6 (15.24mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled