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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-83-640-41-001101

123-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

 3367
- +

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 123-83-640-41-001101

Datasheet

 Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-652-41-001101

612-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

 3900
- +

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 612-83-652-41-001101

Datasheet

 Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-142-15-081101

510-87-142-15-081101

CONN SOCKET PGA 142POS GOLD

Preci-Dip

 3400
- +

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 510-87-142-15-081101

Datasheet

 Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
828-AG11D-ES

828-AG11D-ES

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

 3343
- +

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 828-AG11D-ES

Datasheet

 Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
116-83-632-41-001101

116-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

 3298
- +

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 116-83-632-41-001101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-M

APA-316-T-M

ADAPTER PLUG

Samtec Inc.

 2289
- +

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 Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
714-43-116-31-018000

714-43-116-31-018000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.

 3552
- +

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 714-43-116-31-018000

Datasheet

 Bulk 714 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-83-650-31-012101

614-83-650-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

 2892
- +

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 614-83-650-31-012101

Datasheet

 Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-628-T-J

APA-628-T-J

ADAPTER PLUG

Samtec Inc.

 3804
- +

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 Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-314-T-C

APA-314-T-C

ADAPTER PLUG

Samtec Inc.

 2343
- +

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 Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
124-83-432-41-002101

124-83-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

 2303
- +

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 Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-632-41-002101

124-83-632-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

 2485
- +

Add To Cart

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 Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-004101

116-87-432-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

 3516
- +

Add To Cart

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 116-87-432-41-004101

Datasheet

 Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-148-15-061101

510-87-148-15-061101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

 2125
- +

Add To Cart

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 510-87-148-15-061101

Datasheet

 Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-148-15-062101

510-87-148-15-062101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

 2079
- +

Add To Cart

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 510-87-148-15-062101

Datasheet

 Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-3513-00

18-3513-00

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

 2018
- +

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 18-3513-00

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-950-31-012101

614-83-950-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

 3852
- +

Add To Cart

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 614-83-950-31-012101

Datasheet

 Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-018101

116-83-652-41-018101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

 3209
- +

Add To Cart

Inquiry Now

 116-83-652-41-018101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-324-11-001101

299-83-324-11-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

 2489
- +

Add To Cart

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 299-83-324-11-001101

Datasheet

 Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-10-000101

510-83-100-10-000101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

 2815
- +

Add To Cart

Inquiry Now

 510-83-100-10-000101

Datasheet

 Bulk 510 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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