Sockets for ICs, Transistors - Shenzhen Taoxiong (TX) Electronics Co., Ltd.

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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
10-3503-20 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3044	- + Add To Cart Inquiry Now	Datasheet	Bulk	503	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-184-17-081101 CONN SOCKET PGA 184POS GOLD Preci-Dip	3375	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	184 (17 x 17)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
02-7450-10 CONN SOCKET SIP 2POS TIN Aries Electronics	3741	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
02-7520-10 CONN SOCKET SIP 2POS TIN Aries Electronics	2583	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
02-7540-10 CONN SOCKET SIP 2POS TIN Aries Electronics	3691	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
02-7625-10 CONN SOCKET SIP 2POS TIN Aries Electronics	2706	- + Add To Cart Inquiry Now	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-102 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2458	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-820-90C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2172	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-822-90C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3484	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-823-90C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2906	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
514-87-068-10-001117 CONN SOCKET PGA 68POS GOLD Preci-Dip	2078	- + Add To Cart Inquiry Now	Datasheet	Bulk	514	Active	PGA	68 (10 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-068-10-061117 CONN SOCKET PGA 68POS GOLD Preci-Dip	3670	- + Add To Cart Inquiry Now	Datasheet	Bulk	514	Active	PGA	68 (10 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-009101 CONN IC DIP SOCKET 50POS GOLD Preci-Dip	2117	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-120-31-018000 CONN SOCKET SIP 20POS GOLD Mill-Max Manufacturing Corp.	3577	- + Add To Cart Inquiry Now	Datasheet	Tube	714	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
540-44-020-17-400004 CONN SKT PLCC Mill-Max Manufacturing Corp.	3532	- + Add To Cart Inquiry Now	Datasheet	Tape & Reel (TR)	540	Active	PLCC	20 (4 x 5)	0.050 (1.27mm)	Tin	100.0µin (2.54µm)	-	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	200.0µin (5.08µm)	-	Polyphenylene Sulfide (PPS)
510-87-196-14-000101 CONN SOCKET PGA 196POS GOLD Preci-Dip	2931	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	196 (14 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-1518-11 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	2058	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-102 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3495	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-820-90T CONN IC DIP SOCKET 8POS TIN Aries Electronics	3302	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
510-83-120-13-001101 CONN SOCKET PGA 120POS GOLD Preci-Dip	2024	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	120 (13 x 13)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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