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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-6518-10M

24-6518-10M

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 3773
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 24-6518-10M

Datasheet

 Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
114-91-304-41-117000

114-91-304-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3368
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 114-91-304-41-117000

Datasheet

 Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-9513-10T

32-9513-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3522
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 32-9513-10T

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
50-9518-10T

50-9518-10T

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

 3503
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 50-9518-10T

Datasheet

 Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-112

14-3518-112

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 2952
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 14-3518-112

Datasheet

 Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-822-90E

08-822-90E

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

 2248
- +

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 08-822-90E

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
116-87-636-41-004101

116-87-636-41-004101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

 2384
- +

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 116-87-636-41-004101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
11-0503-20

11-0503-20

CONN SOCKET SIP 11POS GOLD

Aries Electronics

 3178
- +

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 11-0503-20

Datasheet

 Bulk 0503 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
11-0503-30

11-0503-30

CONN SOCKET SIP 11POS GOLD

Aries Electronics

 2736
- +

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 11-0503-30

Datasheet

 Bulk 0503 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
22-0518-11H

22-0518-11H

CONN SOCKET SIP 22POS GOLD

Aries Electronics

 2147
- +

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 22-0518-11H

Datasheet

 Bulk 518 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-1518-11H

22-1518-11H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

 2529
- +

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 22-1518-11H

Datasheet

 Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0508-21

07-0508-21

CONN SOCKET SIP 7POS GOLD

Aries Electronics

 2201
- +

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 07-0508-21

Datasheet

 Bulk 508 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
07-0508-31

07-0508-31

CONN SOCKET SIP 7POS GOLD

Aries Electronics

 3418
- +

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 07-0508-31

Datasheet

 Bulk 508 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
48-6513-10

48-6513-10

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

 2486
- +

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 48-6513-10

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-41-304-41-001000

111-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2178
- +

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 111-41-304-41-001000

Datasheet

 Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-304-41-001000

111-91-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3430
- +

Add To Cart

Inquiry Now

 111-91-304-41-001000

Datasheet

 Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-3503-20

14-3503-20

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 2619
- +

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 14-3503-20

Datasheet

 Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10M

24-4518-10M

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 2803
- +

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 24-4518-10M

Datasheet

 Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-00

26-0518-00

CONN SOCKET SIP 26POS GOLD

Aries Electronics

 2157
- +

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 26-0518-00

Datasheet

 Bulk 518 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-00

26-1518-00

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

 2376
- +

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 26-1518-00

Datasheet

 Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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