Sockets for ICs, Transistors - Shenzhen Taoxiong (TX) Electronics Co., Ltd.

SHOPPING CART

View All >>

Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
08-8625-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2416	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8640-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3178	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8650-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2640	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8690-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3665	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8750-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2407	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8750-610C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3038	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8770-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3969	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8900-310C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2731	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-8937-610C CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3748	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-224-31-018000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2548	- + Add To Cart Inquiry Now	Datasheet	Tube	714	Active	DIP, 0.1 (2.54mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-642-41-004101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	3495	- + Add To Cart Inquiry Now	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-41-304-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3831	- + Add To Cart Inquiry Now	Datasheet	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-304-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2672	- + Add To Cart Inquiry Now	Datasheet	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-6501-31 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3865	- + Add To Cart Inquiry Now	Datasheet	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
08-0508-21 CONN SOCKET SIP 8POS GOLD Aries Electronics	3312	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	SIP	8 (1 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
08-0508-31 CONN SOCKET SIP 8POS GOLD Aries Electronics	2961	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	SIP	8 (1 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
08-1508-21 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2872	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
08-1508-31 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3476	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
10-2820-90 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	2763	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
16-3518-11H CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3387	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled

Total 21991 Records«Prev 1... 234 235 236 237238239 240 241...1100 Next»

Request a Quote

Tel

+8675583995648
Conatct Us
Whatsapp

WILLZOU AMYLIU
Whatsapp

ChenLin CaitlinWeng
GoTop