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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-44-304-61-001000

110-44-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2046
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Tube * Active - - - - - - - - - - - - - -
110-99-304-61-001000

110-99-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2117
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Tube * Active - - - - - - - - - - - - - -
14-81000-310C

14-81000-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2450
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14-81000-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81010-310C

14-81010-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3900
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14-81010-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81040-310C

14-81040-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2147
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14-81040-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81200-310C

14-81200-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3036
- +

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14-81200-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81250-310C

14-81250-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2738
- +

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14-81250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8240-310C

14-8240-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2584
- +

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14-8240-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8250-310C

14-8250-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2704
- +

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14-8250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8270-310C

14-8270-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3770
- +

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14-8270-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8275-310C

14-8275-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2739
- +

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14-8275-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8290-310C

14-8290-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2385
- +

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14-8290-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8300-310C

14-8300-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3707
- +

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14-8300-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8320-310C

14-8320-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3379
- +

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14-8320-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8325-310C

14-8325-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3775
- +

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14-8325-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8346-310C

14-8346-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2737
- +

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14-8346-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8350-310C

14-8350-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2359
- +

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14-8350-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8360-310C

14-8360-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3585
- +

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14-8360-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8375-310C

14-8375-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2850
- +

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14-8375-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8385-310C

14-8385-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3494
- +

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14-8385-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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