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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
111-47-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	3713	- + Add To Cart Inquiry Now	Datasheet	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	2658	- + Add To Cart Inquiry Now	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-3508-20 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	2150	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-30 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	2778	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-01 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	3441	- + Add To Cart Inquiry Now	Datasheet	Bulk	518	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-81250-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2869	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8300-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2021	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8350-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3499	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8400-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3430	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8450-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2656	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8500-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2988	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8540-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2974	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8625-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3904	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-8700-610C CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2600	- + Add To Cart Inquiry Now	Datasheet	Bulk	8	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
110-47-306-41-105000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3286	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-310-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2632	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-310-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3299	- + Add To Cart Inquiry Now	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-314-10-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	2601	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7), 4 Loaded	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-308-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3107	- + Add To Cart Inquiry Now	Datasheet	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-308-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3732	- + Add To Cart Inquiry Now	Datasheet	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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