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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
110-13-316-41-801000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	2838	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2138	- + Add To Cart Inquiry Now	Datasheet	Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2130	- + Add To Cart Inquiry Now	Datasheet	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-324-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2986	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-87-628-41-117101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3886	- + Add To Cart Inquiry Now	Datasheet	Tube	114	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-43-608-10-002000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	2192	- + Add To Cart Inquiry Now	Datasheet	Tube	299	Active	DIP, 0.6 (15.24mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-624-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	3093	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2122	- + Add To Cart Inquiry Now	Datasheet	Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	3890	- + Add To Cart Inquiry Now	Datasheet	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2961	- + Add To Cart Inquiry Now	Datasheet	Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-632-31-012000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	2066	- + Add To Cart Inquiry Now	Datasheet	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-316-10-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	3155	- + Add To Cart Inquiry Now	Datasheet	Tube	299	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-610-10-002000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	2792	- + Add To Cart Inquiry Now	Datasheet	Tube	299	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-628-41-801000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	100	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-628-41-801000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	3048	- + Add To Cart Inquiry Now	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APO-308-G-H CONN DIP ADAPT 8POS Samtec Inc.	3631	- + Add To Cart Inquiry Now		Bulk	APO	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
4732 COVER PWR TRANS .210ID TO-3 Keystone Electronics	2735	- + Add To Cart Inquiry Now	Datasheet	Bulk	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
XR2P2041 CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div	100	- + Add To Cart Inquiry Now	Datasheet	Bulk	XR2	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Threaded	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled
08-823-90 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3656	- + Add To Cart Inquiry Now	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
299-93-320-10-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	3420	- + Add To Cart Inquiry Now	Datasheet	Bulk	299	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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