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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-1518-10H

06-1518-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

 3950
- +

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 06-1518-10H

Datasheet

 Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0517-90C

02-0517-90C

CONN SOCKET SIP 2POS GOLD

Aries Electronics

 3579
- +

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 02-0517-90C

Datasheet

 Bulk 0517 Active SIP 2 (1 x 2) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-610-41-002101

116-87-610-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 2044
- +

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 116-87-610-41-002101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-312-41-001101

614-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 3482
- +

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 614-83-312-41-001101

Datasheet

 Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-003101

116-87-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

 3280
- +

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 116-87-314-41-003101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-003101

116-83-610-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

 3951
- +

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 116-83-610-41-003101

Datasheet

 Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-314-41-003101

115-83-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

 3918
- +

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 115-83-314-41-003101

Datasheet

 Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-320-41-003101

115-87-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

 3737
- +

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 115-87-320-41-003101

Datasheet

 Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-420-41-003101

115-87-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

 2929
- +

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 115-87-420-41-003101

Datasheet

 Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-322-41-001101

115-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

 3437
- +

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 Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-422-41-001101

115-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

 2396
- +

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 Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-3518-10

06-3518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

 3668
- +

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 06-3518-10

Datasheet

 Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-11

05-0518-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics

 3151
- +

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 05-0518-11

Datasheet

 Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
AR 18-HZL/07-TT

AR 18-HZL/07-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

 2753
- +

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 AR 18-HZL/07-TT

Datasheet

 Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
110-83-312-41-105101

110-83-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 2313
- +

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 110-83-312-41-105101

Datasheet

 Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-316-41-001101

612-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

 3305
- +

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 612-87-316-41-001101

Datasheet

 Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-011101

116-87-308-41-011101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

 3587
- +

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 116-87-308-41-011101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-009101

116-83-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

 2018
- +

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 116-83-308-41-009101

Datasheet

 Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-312-41-001101

612-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

 3330
- +

Add To Cart

Inquiry Now

 612-83-312-41-001101

Datasheet

 Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-020-05-001101

510-83-020-05-001101

CONN SOCKET PGA 20POS GOLD

Preci-Dip

 2598
- +

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 510-83-020-05-001101

Datasheet

 Bulk 510 Active PGA 20 (5 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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