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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
14-0501-31 CONN SOCKET SIP 14POS GOLD Aries Electronics	2492	- + Añadir Investigación	Datasheet	Bulk	501	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-01 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	3861	- + Añadir Investigación	Datasheet	Bulk	518	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-6820-90C CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3832	- + Añadir Investigación	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-6822-90C CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3574	- + Añadir Investigación	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-6823-90C CONN IC DIP SOCKET 20POS GOLD Aries Electronics	2375	- + Añadir Investigación	Datasheet	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-308-41-001000 SOCKET CARRIER SLDRTL .300 8POS Mill-Max Manufacturing Corp.	3151	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-652-41-001000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	2632	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-422-41-605000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3708	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-640-41-003000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	2641	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-316-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2083	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-324-41-605000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2493	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-624-41-605000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2214	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-324-41-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3590	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-624-41-605000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3308	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-8865-310C CONN ELEVATOR SOCKET 20 PO .300 Aries Electronics	3771	- + Añadir Investigación		-	8	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
410-93-220-10-002000 SOCKET DUAL IN-LINE SLDRTL 20POS Mill-Max Manufacturing Corp.	2932	- + Añadir Investigación	Datasheet	Tube	410	Active	Zig-Zag, Right Stackable	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-428-41-105000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3347	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-628-41-105000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3938	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-432-41-117000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	3647	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-632-41-117000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	2424	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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