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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
32-6556-10 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	2286	- + Añadir Investigación	Datasheet	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
16-0508-21 CONN SOCKET SIP 16POS GOLD Aries Electronics	3537	- + Añadir Investigación	Datasheet	Bulk	508	Active	SIP	16 (1 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
16-0508-31 CONN SOCKET SIP 16POS GOLD Aries Electronics	2828	- + Añadir Investigación	Datasheet	Bulk	508	Active	SIP	16 (1 x 16)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
605-41-316-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	3527	- + Añadir Investigación	Datasheet	Tube	605	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-316-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	3153	- + Añadir Investigación	Datasheet	Tube	605	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-116-41-005000 CONN SKT SNG Mill-Max Manufacturing Corp.	3184	- + Añadir Investigación	Datasheet	Tube	317	Active	SIP	16 (1 x 16)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-322-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2462	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-422-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2758	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-316-41-001000 SOCKET IC OPEN 3 LVL .300 16POS Mill-Max Manufacturing Corp.	2405	- + Añadir Investigación		Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-316-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3748	- + Añadir Investigación	Datasheet	Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-1508-21 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3525	- + Añadir Investigación	Datasheet	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
16-1508-31 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2384	- + Añadir Investigación	Datasheet	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
317-91-115-41-005000 CONN SKT SNG Mill-Max Manufacturing Corp.	3343	- + Añadir Investigación	Datasheet	Bulk	317	Active	SIP	15 (1 x 15)	0.070 (1.78mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-43-115-41-005000 CONN SKT STRIP Mill-Max Manufacturing Corp.	3565	- + Añadir Investigación	Datasheet	Bulk	317	Active	SIP	15 (1 x 15)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.070 (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-318-41-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3794	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-318-41-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2274	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-322-41-007000 STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp.	3988	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-422-41-007000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3119	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-432-41-105000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3632	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-632-41-105000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	2803	- + Añadir Investigación	Datasheet	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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