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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
104-13-316-41-770000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	2629	- + Añadir Investigación	Datasheet	Tube	104	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic
614-41-318-31-018000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	3383	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-318-31-018000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	3030	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-432-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	2999	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-120-31-012000 SOCKET CARRIER SIP 20POS Mill-Max Manufacturing Corp.	3906	- + Añadir Investigación	Datasheet	Tube	714	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-432-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2533	- + Añadir Investigación	Datasheet	Tube	115	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-328-41-117000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2946	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-428-41-117000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	3133	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-628-41-117000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2824	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-328-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2723	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-428-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3141	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-628-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3536	- + Añadir Investigación	Datasheet	Tube	114	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2257	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	2679	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3572-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	2624	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
24-3573-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	3081	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
24-3574-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	3534	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
24-3575-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	2427	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
24-6571-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	3531	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
210-13-424-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2376	- + Añadir Investigación	Datasheet	Tube	210	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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