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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
111-91-652-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2755	- + Añadir Investigación	Datasheet	Tube	111	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-324-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2087	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-424-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2168	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-624-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2582	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-324-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2405	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-424-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2280	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-624-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2184	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-320-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	2081	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-420-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	3852	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-320-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3018	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-420-41-001000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3532	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6503-21 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2607	- + Añadir Investigación	Datasheet	Bulk	503	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
16-6503-31 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2440	- + Añadir Investigación	Datasheet	Bulk	503	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
18-0503-21 CONN SOCKET SIP 18POS GOLD Aries Electronics	2379	- + Añadir Investigación	Datasheet	Bulk	0503	Active	SIP	18 (1 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled
18-0503-31 CONN SOCKET SIP 18POS GOLD Aries Electronics	2573	- + Añadir Investigación	Datasheet	Bulk	0503	Active	SIP	18 (1 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled
612-41-328-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3728	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-428-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2923	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-628-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3432	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-328-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2388	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-428-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3646	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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