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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
117-47-668-41-005000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	2125	- + Añadir Investigación	Datasheet	Tube	117	Active	DIP, 0.6 (15.24mm) Row Spacing	68 (2 x 34)	0.070 (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-47-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2923	- + Añadir Investigación	Datasheet	Tube	123	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-47-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2240	- + Añadir Investigación	Datasheet	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-47-428-41-001000 STANDARD WIRE WRAP DBL SKT Mill-Max Manufacturing Corp.	2432	- + Añadir Investigación	Datasheet	Tube	123	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-318-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3439	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-318-41-003000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3900	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-0508-21 CONN SOCKET SIP 18POS GOLD Aries Electronics	3181	- + Añadir Investigación	Datasheet	Bulk	508	Active	SIP	18 (1 x 18)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
18-0508-31 CONN SOCKET SIP 18POS GOLD Aries Electronics	2207	- + Añadir Investigación	Datasheet	Bulk	508	Active	SIP	18 (1 x 18)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
122-11-320-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3491	- + Añadir Investigación	Datasheet	Tube	122	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-420-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2835	- + Añadir Investigación	Datasheet	Tube	122	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-8800-610C CONN ELEVATOR SOCKET 32 PIN .600 Aries Electronics	3702	- + Añadir Investigación		-	8	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
614-41-328-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2006	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-428-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2922	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-628-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2591	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-328-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2190	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-428-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	3176	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-628-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	3309	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-648-41-007000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	3017	- + Añadir Investigación	Datasheet	Tube	116	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-316-41-002000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	3158	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-316-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2741	- + Añadir Investigación	Datasheet	Tube	126	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

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