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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-964-41-001000

110-91-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

 2665
- +

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Investigación

 110-91-964-41-001000

Datasheet

 Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-964-41-001000

110-41-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2898
- +

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Investigación

 110-41-964-41-001000

Datasheet

 Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-324-41-001000

121-11-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2494
- +

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Investigación

 121-11-324-41-001000

Datasheet

 Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-424-41-001000

121-11-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3775
- +

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Investigación

 121-11-424-41-001000

Datasheet

 Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-624-41-001000

121-11-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3395
- +

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Investigación

 121-11-624-41-001000

Datasheet

 Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-318-41-002000

124-41-318-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3652
- +

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Investigación

 124-41-318-41-002000

Datasheet

 Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-318-41-002000

124-91-318-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2072
- +

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Investigación

 124-91-318-41-002000

Datasheet

 Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-47-652-41-005000

117-47-652-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

 3404
- +

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Investigación

 117-47-652-41-005000

Datasheet

 Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-642-11-480000

605-41-642-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

 2803
- +

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Investigación

 605-41-642-11-480000

Datasheet

 Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-642-11-480000

605-91-642-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

 3804
- +

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Investigación

 605-91-642-11-480000

Datasheet

 Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
50-9513-11

50-9513-11

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

 2612
- +

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Investigación

 50-9513-11

Datasheet

 Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
50-9518-10M

50-9518-10M

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

 3649
- +

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Investigación

 50-9518-10M

Datasheet

 Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C195-21

14-C195-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 2409
- +

Añadir

Investigación

 14-C195-21

Datasheet

 Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C195-31

14-C195-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 3098
- +

Añadir

Investigación

 14-C195-31

Datasheet

 Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C280-21

14-C280-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 2261
- +

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Investigación

 14-C280-21

Datasheet

 Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C280-31

14-C280-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 2011
- +

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Investigación

 14-C280-31

Datasheet

 Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
123-91-328-41-001000

123-91-328-41-001000

SOCKET IC OPEN 3 LVL .300 28POS

Mill-Max Manufacturing Corp.

 3273
- +

Añadir

Investigación

 Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-428-41-001000

123-91-428-41-001000

SOCKET IC OPEN 3 LVL .400 28POS

Mill-Max Manufacturing Corp.

 2333
- +

Añadir

Investigación

 Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-628-41-001000

123-91-628-41-001000

SOCKET IC OPEN 3 LVL .600 28POS

Mill-Max Manufacturing Corp.

 3846
- +

Añadir

Investigación

 Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-328-41-001000

123-41-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2230
- +

Añadir

Investigación

 123-41-328-41-001000

Datasheet

 Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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