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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
714-43-260-31-018000 CONN IC DIP SOCKET 60POS GOLD Mill-Max Manufacturing Corp.	2370	- + Añadir Investigación	Datasheet	Bulk	714	Active	DIP, 0.1 (2.54mm) Row Spacing	60 (2 x 30)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-428-31-012000 SOCKET CARRIER LOWPRO .400 28POS Mill-Max Manufacturing Corp.	2270	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-428-31-012000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2239	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-328-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2385	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-428-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3210	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-628-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2893	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-328-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2835	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-428-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3498	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-628-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2986	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-642-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	2435	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-642-31-002000 SKT CARRIER PGA Mill-Max Manufacturing Corp.	3215	- + Añadir Investigación	Datasheet	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-318-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2770	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-318-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2206	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
TMJ03DKSD-S1512 CONN TRANSIST TO-254 3POS GOLD Sullins Connector Solutions	2719	- + Añadir Investigación	Datasheet	Tray	-	Active	Transistor, TO-254	3 (Rectangular)	0.150 (3.81mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Flange	Solder	0.150 (3.81mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
605-93-640-11-480000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	2978	- + Añadir Investigación	Datasheet	Tube	605	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-640-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp.	2734	- + Añadir Investigación	Datasheet	Tube	605	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
23-7400-10 CONN SOCKET SIP 23POS TIN Aries Electronics	2736	- + Añadir Investigación	Datasheet	Bulk	700 Elevator Strip-Line™	Active	SIP	23 (1 x 23)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-20 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	3478	- + Añadir Investigación	Datasheet	Bulk	503	Active	DIP, 0.3 (7.62mm) Row Spacing	34 (2 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-30 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	3181	- + Añadir Investigación	Datasheet	Bulk	503	Active	DIP, 0.3 (7.62mm) Row Spacing	34 (2 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
81-PGM09001-10 CONN SOCKET PGA GOLD Aries Electronics	3472	- + Añadir Investigación	Datasheet	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled

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