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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-13-628-41-001000

612-13-628-41-001000

SOCKET CARRIER SLDRTL .600 28POS

Mill-Max Manufacturing Corp.

2840
- +

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Investigación

612-13-628-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-068-10-041001

510-93-068-10-041001

PGA SOCK 68PIN 10X10 SOLDER TL

Mill-Max Manufacturing Corp.

3957
- +

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Investigación

Tube 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-068-11-061001

510-93-068-11-061001

PGA SOCK 68PIN 11X11 SOLDER TL

Mill-Max Manufacturing Corp.

3264
- +

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Investigación

Tube 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-950-41-001000

111-41-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2449
- +

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Investigación

111-41-950-41-001000

Datasheet

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-950-41-001000

111-91-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2452
- +

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Investigación

111-91-950-41-001000

Datasheet

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-322-41-003000

126-41-322-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2913
- +

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Investigación

126-41-322-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-422-41-003000

126-41-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3210
- +

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Investigación

126-41-422-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-322-41-003000

126-91-322-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3311
- +

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Investigación

126-91-322-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-422-41-003000

126-91-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2926
- +

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Investigación

126-91-422-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6501-21

32-6501-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2695
- +

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Investigación

32-6501-21

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6501-31

32-6501-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2696
- +

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Investigación

32-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
123-93-428-41-001000

123-93-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3396
- +

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Investigación

123-93-428-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-428-41-001000

123-43-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2892
- +

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Investigación

123-43-428-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-648-41-001000

614-41-648-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2273
- +

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Investigación

614-41-648-41-001000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-648-41-001000

614-91-648-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2689
- +

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Investigación

614-91-648-41-001000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-6518-11H

48-6518-11H

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2625
- +

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Investigación

48-6518-11H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-632-G-A1

APA-632-G-A1

ADAPTER PLUG

Samtec Inc.

3059
- +

Añadir

Investigación

Bulk APA Active - 32 (2 x 16) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
123-47-650-41-001000

123-47-650-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3419
- +

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Investigación

123-47-650-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-652-41-001000

111-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3916
- +

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Investigación

111-93-652-41-001000

Datasheet

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-652-41-001000

111-43-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3326
- +

Añadir

Investigación

111-43-652-41-001000

Datasheet

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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