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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-43-432-41-002000

126-43-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2706
- +

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Investigación

 126-43-432-41-002000

Datasheet

 Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-632-41-002000

126-43-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2137
- +

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Investigación

 126-43-632-41-002000

Datasheet

 Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-6823-90

28-6823-90

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

 2565
- +

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Investigación

 28-6823-90

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
30-0501-20

30-0501-20

CONN SOCKET SIP 30POS TIN

Aries Electronics

 2418
- +

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Investigación

 30-0501-20

Datasheet

 Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-0501-30

30-0501-30

CONN SOCKET SIP 30POS TIN

Aries Electronics

 2391
- +

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Investigación

 30-0501-30

Datasheet

 Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-00

02-0518-00

CONN SOCKET SIP 2POS GOLD

Aries Electronics

 2704
- +

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Investigación

 02-0518-00

Datasheet

 Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-202

32-6508-202

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2346
- +

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Investigación

 32-6508-202

Datasheet

 Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-302

32-6508-302

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3620
- +

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Investigación

 32-6508-302

Datasheet

 Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-41-652-31-007000

614-41-652-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 3059
- +

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Investigación

 614-41-652-31-007000

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-652-31-007000

614-91-652-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 2438
- +

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Investigación

 614-91-652-31-007000

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-6501-21

30-6501-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

 3010
- +

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Investigación

 30-6501-21

Datasheet

 Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6501-31

30-6501-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

 3737
- +

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Investigación

 30-6501-31

Datasheet

 Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
605-41-950-11-480000

605-41-950-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

 3654
- +

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Investigación

 605-41-950-11-480000

Datasheet

 Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-950-11-480000

605-91-950-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

 3058
- +

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Investigación

 605-91-950-11-480000

Datasheet

 Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-650-41-780000

104-11-650-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2329
- +

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Investigación

 104-11-650-41-780000

Datasheet

 Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-652-41-001000

614-41-652-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 2471
- +

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Investigación

 614-41-652-41-001000

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-652-41-001000

614-91-652-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 3370
- +

Añadir

Investigación

 614-91-652-41-001000

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-648-31-007000

614-93-648-31-007000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

 3436
- +

Añadir

Investigación

 614-93-648-31-007000

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-648-31-007000

614-43-648-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 3068
- +

Añadir

Investigación

 614-43-648-31-007000

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-636-41-002000

126-41-636-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3035
- +

Añadir

Investigación

 126-41-636-41-002000

Datasheet

 Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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