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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-81250-610C

32-81250-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3963
- +

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Investigación

 32-81250-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8240-610C

32-8240-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3744
- +

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Investigación

 32-8240-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8312-610C

32-8312-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2832
- +

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Investigación

 32-8312-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8350-610C

32-8350-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2929
- +

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Investigación

 32-8350-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8370-610C

32-8370-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2146
- +

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Investigación

 32-8370-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8375-610C

32-8375-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3944
- +

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Investigación

 32-8375-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8540-610C

32-8540-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3284
- +

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Investigación

 32-8540-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8600-610C

32-8600-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2587
- +

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Investigación

 32-8600-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8724-310C

32-8724-310C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3081
- +

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Investigación

 32-8724-310C

Datasheet

 Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8724-610C

32-8724-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3647
- +

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Investigación

 32-8724-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-8850-610C

32-8850-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 2989
- +

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Investigación

 32-8850-610C

Datasheet

 Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6501-21

40-6501-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 2004
- +

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Investigación

 40-6501-21

Datasheet

 Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6823-90

32-6823-90

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 3055
- +

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Investigación

 32-6823-90

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
510-91-132-13-041001

510-91-132-13-041001

SOCKET SOLDERTAIL 132-PGA

Mill-Max Manufacturing Corp.

 3264
- +

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Investigación

 Tube 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-314-61-003000

115-44-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3154
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
614-41-964-31-012000

614-41-964-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 3977
- +

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Investigación

 614-41-964-31-012000

Datasheet

 Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-964-31-012000

614-91-964-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 2422
- +

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Investigación

 614-91-964-31-012000

Datasheet

 Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-306-61-003000

115-43-306-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2178
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
115-93-306-61-003000

115-93-306-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3627
- +

Añadir

Investigación

 Tube * Active - - - - - - - - - - - - - -
126-41-952-41-001000

126-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3598
- +

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Investigación

 126-41-952-41-001000

Datasheet

 Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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