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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
48-6501-21 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	3293	- + Añadir Investigación	Datasheet	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
48-6501-31 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	3951	- + Añadir Investigación	Datasheet	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-650-41-001000 SOCKET CARRIER SLDRTL .600 50POS Mill-Max Manufacturing Corp.	3874	- + Añadir Investigación	Datasheet	Tube	612	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-432-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3517	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
115-43-632-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3965	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
115-93-432-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3274	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
115-93-632-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2472	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
517-83-364-17-091111 CONN SOCKET PGA 364POS GOLD Preci-Dip	2541	- + Añadir Investigación	Datasheet	Bulk	517	Active	PGA	364 (17 x 17)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-43-316-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3287	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-316-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2812	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-44-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2201	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-99-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2568	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-324-G-B ADAPTER PLUG Samtec Inc.	2238	- + Añadir Investigación		Bulk	APA	Active	-	24 (2 x 12)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
APA-624-G-B ADAPTER PLUG Samtec Inc.	3486	- + Añadir Investigación		Bulk	APA	Active	-	24 (2 x 12)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
116-43-314-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2714	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-314-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3112	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
510-93-128-13-041001 SOCKET SOLDERTAIL 128-PGA Mill-Max Manufacturing Corp.	3419	- + Añadir Investigación		Tube	510	Active	PGA	128 (13 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-128-13-041001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3758	- + Añadir Investigación	Datasheet	Tube	510	Active	PGA	128 (13 x 13)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-3570-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2532	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
42-3571-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	3389	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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