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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-91-072-09-001002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2719	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	72 (9 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-09-001003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3744	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	72 (9 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-042002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2564	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	72 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-042003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3588	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	72 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2246	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	72 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-072-11-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2469	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	72 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
416-93-264-41-001000 SOCKET DUAL INLINE ELEVATD 64POS Mill-Max Manufacturing Corp.	3606	- + Añadir Investigación	Datasheet	Tube	416	Active	DIP, 0.1 (2.54mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	-	-	Closed Frame	-	-	-	-	-	-
510-93-049-07-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2622	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	49 (7 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-049-07-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2290	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	49 (7 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3588	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
111-93-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3067	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-43-642-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2572	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-93-642-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3658	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
115-43-650-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2575	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
115-93-650-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3902	- + Añadir Investigación		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
48-3570-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3783	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3571-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3208	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3572-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	2694	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3573-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3843	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3575-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3134	- + Añadir Investigación	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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