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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-121-15-061002

510-91-121-15-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3192
- +

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Investigación

 510-91-121-15-061002

Datasheet

 Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-124-13-041001

510-41-124-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3128
- +

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Investigación

 510-41-124-13-041001

Datasheet

 Bulk 510 Active PGA 124 (13 x 13) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-056-09-041001

510-13-056-09-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2061
- +

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Investigación

 510-13-056-09-041001

Datasheet

 Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-056-09-041002

510-13-056-09-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2921
- +

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Investigación

 510-13-056-09-041002

Datasheet

 Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-056-09-041003

510-13-056-09-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2423
- +

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Investigación

 510-13-056-09-041003

Datasheet

 Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-3551-11

40-3551-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3350
- +

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Investigación

 40-3551-11

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3552-11

40-3552-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3484
- +

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Investigación

 40-3552-11

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3553-11

40-3553-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3368
- +

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Investigación

 40-3553-11

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6551-11

40-6551-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 2388
- +

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Investigación

 40-6551-11

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6552-11

40-6552-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3837
- +

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Investigación

 40-6552-11

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6553-11

40-6553-11

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 2022
- +

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Investigación

 40-6553-11

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3554-11

40-3554-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 2599
- +

Añadir

Investigación

 40-3554-11

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
38-0508-21

38-0508-21

CONN SOCKET SIP 38POS GOLD

Aries Electronics

 2928
- +

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Investigación

 38-0508-21

Datasheet

 Bulk 508 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
38-0508-31

38-0508-31

CONN SOCKET SIP 38POS GOLD

Aries Electronics

 2842
- +

Añadir

Investigación

 38-0508-31

Datasheet

 Bulk 508 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
510-93-096-11-041001

510-93-096-11-041001

SOCKET SOLDERTAIL 96-PGA

Mill-Max Manufacturing Corp.

 3426
- +

Añadir

Investigación

 Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-096-11-041002

510-93-096-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2605
- +

Añadir

Investigación

 510-93-096-11-041002

Datasheet

 Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-096-11-041003

510-93-096-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2745
- +

Añadir

Investigación

 510-93-096-11-041003

Datasheet

 Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-1508-21

38-1508-21

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

 3912
- +

Añadir

Investigación

 38-1508-21

Datasheet

 Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
38-1508-31

38-1508-31

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

 3323
- +

Añadir

Investigación

 38-1508-31

Datasheet

 Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-3570-11

32-3570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

 2879
- +

Añadir

Investigación

 32-3570-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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