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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-088-13-081002

510-13-088-13-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3760
- +

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Investigación

 510-13-088-13-081002

Datasheet

 Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-081003

510-13-088-13-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3210
- +

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Investigación

 510-13-088-13-081003

Datasheet

 Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-062001

510-13-088-13-062001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2771
- +

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Investigación

 510-13-088-13-062001

Datasheet

 Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-081001

510-13-088-13-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2224
- +

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Investigación

 510-13-088-13-081001

Datasheet

 Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
518-77-256M16-000105

518-77-256M16-000105

CONN SOCKET PGA 256POS GOLD

Preci-Dip

 2807
- +

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Investigación

 518-77-256M16-000105

Datasheet

 Bulk 518 Active PGA 256 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-256M20-001105

518-77-256M20-001105

CONN SOCKET PGA 256POS GOLD

Preci-Dip

 3364
- +

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Investigación

 518-77-256M20-001105

Datasheet

 Bulk 518 Active PGA 256 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
APA-648-G-N

APA-648-G-N

ADAPTER PLUG

Samtec Inc.

 2397
- +

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Investigación

 Tube APA Active - 48 (2 x 24) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-91-196-14-000002

510-91-196-14-000002

SOCKET SOLDERTAIL 196-PGA

Mill-Max Manufacturing Corp.

 3895
- +

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Investigación

 Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-196-14-000001

510-91-196-14-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2284
- +

Añadir

Investigación

 510-91-196-14-000001

Datasheet

 Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-196-14-000003

510-91-196-14-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3736
- +

Añadir

Investigación

 510-91-196-14-000003

Datasheet

 Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6574-11

40-6574-11

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 3829
- +

Añadir

Investigación

 40-6574-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3574-11

40-3574-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3935
- +

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Investigación

 40-3574-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6573-11

40-6573-11

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 2187
- +

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Investigación

 40-6573-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3570-11

40-3570-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3133
- +

Añadir

Investigación

 40-3570-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3571-11

40-3571-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3102
- +

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Investigación

 40-3571-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3572-11

40-3572-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 2110
- +

Añadir

Investigación

 40-3572-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3573-11

40-3573-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3243
- +

Añadir

Investigación

 40-3573-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3575-11

40-3575-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3888
- +

Añadir

Investigación

 40-3575-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6570-11

40-6570-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3709
- +

Añadir

Investigación

 40-6570-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6571-11

40-6571-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 2883
- +

Añadir

Investigación

 40-6571-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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