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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-3570-16

28-3570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2745
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 28-3570-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6570-16

28-6570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 3494
- +

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 28-6570-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6571-16

28-6571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 3238
- +

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Investigación

 28-6571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6573-16

28-6573-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 3707
- +

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Investigación

 28-6573-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3571-16

28-3571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2819
- +

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Investigación

 28-3571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3572-16

28-3572-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2974
- +

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Investigación

 28-3572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3573-16

28-3573-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2415
- +

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Investigación

 28-3573-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3574-16

28-3574-16

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

 3153
- +

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Investigación

 28-3574-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6572-16

28-6572-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 2518
- +

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Investigación

 28-6572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6574-16

28-6574-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 3134
- +

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Investigación

 28-6574-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-41-281-19-081002

510-41-281-19-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2115
- +

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Investigación

 510-41-281-19-081002

Datasheet

 Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081002

510-91-281-19-081002

SOCKET SOLDERTAIL 281-PGA

Mill-Max Manufacturing Corp.

 3173
- +

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Investigación

 Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081001

510-91-281-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3519
- +

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Investigación

 510-91-281-19-081001

Datasheet

 Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081003

510-91-281-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2077
- +

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Investigación

 510-91-281-19-081003

Datasheet

 Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-480M29-001166

550-10-480M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

 3829
- +

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Investigación

 550-10-480M29-001166

Datasheet

 Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-599-54-131111

517-83-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip

 2914
- +

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Investigación

 517-83-599-54-131111

Datasheet

 Bulk 517 Active PGA 599 (54 x 54) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
210-2599-50-0602

210-2599-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 210

3M

 3082
- +

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Investigación

 Box - Active - - - - - - - - - - - - - -
48-6503-21

48-6503-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

 2669
- +

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Investigación

 48-6503-21

Datasheet

 Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6503-31

48-6503-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

 2100
- +

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Investigación

 48-6503-31

Datasheet

 Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-292M20-001106

518-77-292M20-001106

CONN SOCKET PGA 292POS GOLD

Preci-Dip

 2491
- +

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Investigación

 518-77-292M20-001106

Datasheet

 Bulk 518 Active PGA 292 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
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