España Hola! Bienvenido a visitar Шэньчжэньская микроэлектронная компания Хунтай !

Carrito de compras

Proyecto (S)
Catálogo de productos
Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-83-356M26-001148

514-83-356M26-001148

CONN SOCKET BGA 356POS GOLD

Preci-Dip

 2200
- +

Añadir

Investigación

 514-83-356M26-001148

Datasheet

 Bulk 514 Active BGA 356 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-296-19-131135

550-10-296-19-131135

PGA SOLDER TAIL

Preci-Dip

 2128
- +

Añadir

Investigación

 550-10-296-19-131135

Datasheet

 Bulk 550 Active PGA 296 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-142-15-085003

510-13-142-15-085003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2041
- +

Añadir

Investigación

 510-13-142-15-085003

Datasheet

 Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
175-PGM16003-11H

175-PGM16003-11H

CONN SOCKET PGA GOLD

Aries Electronics

 3818
- +

Añadir

Investigación

 175-PGM16003-11H

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
175-PGM16008-11

175-PGM16008-11

CONN SOCKET PGA GOLD

Aries Electronics

 2970
- +

Añadir

Investigación

 175-PGM16008-11

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-83-360M19-001148

514-83-360M19-001148

CONN SOCKET BGA 360POS GOLD

Preci-Dip

 3393
- +

Añadir

Investigación

 514-83-360M19-001148

Datasheet

 Bulk 514 Active BGA 360 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-357M19-001152

550-10-357M19-001152

BGA SOLDER TAIL

Preci-Dip

 2056
- +

Añadir

Investigación

 550-10-357M19-001152

Datasheet

 Bulk 550 Active BGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
50-9503-21

50-9503-21

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

 2102
- +

Añadir

Investigación

 50-9503-21

Datasheet

 Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
50-9503-31

50-9503-31

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

 2342
- +

Añadir

Investigación

 50-9503-31

Datasheet

 Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6574-16

32-6574-16

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

 3404
- +

Añadir

Investigación

 32-6574-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-13-144-12-000001

510-13-144-12-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3994
- +

Añadir

Investigación

 510-13-144-12-000001

Datasheet

 Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-12-000002

510-13-144-12-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3758
- +

Añadir

Investigación

 510-13-144-12-000002

Datasheet

 Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-12-000003

510-13-144-12-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2807
- +

Añadir

Investigación

 510-13-144-12-000003

Datasheet

 Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-13-041001

510-13-144-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2760
- +

Añadir

Investigación

 510-13-144-13-041001

Datasheet

 Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-13-041002

510-13-144-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3380
- +

Añadir

Investigación

 510-13-144-13-041002

Datasheet

 Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-13-041003

510-13-144-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2620
- +

Añadir

Investigación

 510-13-144-13-041003

Datasheet

 Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-15-082002

510-13-144-15-082002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2959
- +

Añadir

Investigación

 510-13-144-15-082002

Datasheet

 Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-15-082003

510-13-144-15-082003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2936
- +

Añadir

Investigación

 510-13-144-15-082003

Datasheet

 Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-15-082001

510-13-144-15-082001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3804
- +

Añadir

Investigación

 510-13-144-15-082001

Datasheet

 Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-360M19-001152

550-10-360M19-001152

BGA SOLDER TAIL

Preci-Dip

 2211
- +

Añadir

Investigación

 550-10-360M19-001152

Datasheet

 Bulk 550 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
Total 21991 Records«Prev1... 690691692693694695696697...1100Next»
Solicitud de cotización
Número de pieza
Cantidad
Contacto
Correo electrónico
Empresa
Comentarios