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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-3553-16

48-3553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

 2432
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 48-3553-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6551-16

48-6551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

 2009
- +

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 48-6551-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6552-16

48-6552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

 2751
- +

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Investigación

 48-6552-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6553-16

48-6553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

 3728
- +

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Investigación

 48-6553-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3554-16

48-3554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

 2387
- +

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Investigación

 48-3554-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6554-16

48-6554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

 2752
- +

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Investigación

 48-6554-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
234-3034-01-0602

234-3034-01-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M

 2598
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Investigación

 234-3034-01-0602

Datasheet

 Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (1 x 34) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
558-10-652M35-001101

558-10-652M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 2733
- +

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Investigación

 558-10-652M35-001101

Datasheet

 Bulk 558 Active PGA 652 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-361-18-101135

550-10-361-18-101135

PGA SOLDER TAIL

Preci-Dip

 3871
- +

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Investigación

 550-10-361-18-101135

Datasheet

 Bulk 550 Active PGA 361 (18 x 18) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
80-PRS15072-12

80-PRS15072-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 3156
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Investigación

 80-PRS15072-12

Datasheet

 Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
191-PGM18015-10T

191-PGM18015-10T

CONN SOCKET PGA TIN

Aries Electronics

 2168
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Investigación

 191-PGM18015-10T

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
120-PLS13015-12

120-PLS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 3370
- +

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Investigación

 120-PLS13015-12

Datasheet

 Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
120-PRS13015-12

120-PRS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 2349
- +

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Investigación

 120-PRS13015-12

Datasheet

 Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
47-PLS16021-12

47-PLS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 3632
- +

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Investigación

 47-PLS16021-12

Datasheet

 Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
47-PRS16021-12

47-PRS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 3115
- +

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Investigación

 47-PRS16021-12

Datasheet

 Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PLS13013-12

121-PLS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 2678
- +

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Investigación

 121-PLS13013-12

Datasheet

 Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PLS13106-12

121-PLS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 2043
- +

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Investigación

 121-PLS13106-12

Datasheet

 Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PRS13013-12

121-PRS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 2185
- +

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Investigación

 121-PRS13013-12

Datasheet

 Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PRS13106-12

121-PRS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

 2793
- +

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Investigación

 121-PRS13106-12

Datasheet

 Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
510-13-400-20-000001

510-13-400-20-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3411
- +

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Investigación

 510-13-400-20-000001

Datasheet

 Bulk 510 Active PGA 400 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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