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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
212-1-08-003

212-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

 3394
- +

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Investigación

 212-1-08-003

Datasheet

 Tube - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-14-003

212-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

 2011
- +

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Investigación

 212-1-14-003

Datasheet

 Tube - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-16-003

212-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

 3873
- +

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Investigación

 212-1-16-003

Datasheet

 Tube - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-18-003

212-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

 3332
- +

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Investigación

 212-1-18-003

Datasheet

 Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-20-003

212-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech

 3041
- +

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Investigación

 212-1-20-003

Datasheet

 Tube - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-24-006

212-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech

 3208
- +

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Investigación

 212-1-24-006

Datasheet

 Tube - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-28-006

212-1-28-006

CONN IC DIP SOCKET 28POS GOLD

CNC Tech

 2919
- +

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Investigación

 212-1-28-006

Datasheet

 Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-32-006

212-1-32-006

CONN IC DIP SOCKET 32POS GOLD

CNC Tech

 2972
- +

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Investigación

 212-1-32-006

Datasheet

 Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-40-006

212-1-40-006

CONN IC DIP SOCKET 40POS GOLD

CNC Tech

 2100
- +

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Investigación

 212-1-40-006

Datasheet

 Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
212-1-48-006

212-1-48-006

CONN IC DIP SOCKET 48POS GOLD

CNC Tech

 3586
- +

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Investigación

 212-1-48-006

Datasheet

 Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
241-48-1-06

241-48-1-06

CONN IC DIP SOCKET 48POS TIN

CNC Tech

 3631
- +

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Investigación

 241-48-1-06

Datasheet

 Tube - Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
523-93-121-13-061001

523-93-121-13-061001

PGA SOCK 121PIN 13X13 WIRE WRAP

Mill-Max Manufacturing Corp.

 3398
- +

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Investigación

 523-93-121-13-061001

Datasheet

 Bulk 523 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
C8108-04

C8108-04

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

 2095
- +

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Investigación

 C8108-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8114-04

C8114-04

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

 2282
- +

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Investigación

 C8114-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8116-04

C8116-04

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

 3127
- +

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Investigación

 C8116-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8118-04

C8118-04

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

 2786
- +

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Investigación

 C8118-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8120-04

C8120-04

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

 2549
- +

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Investigación

 C8120-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8122-04

C8122-04

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

 2386
- +

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Investigación

 C8122-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8124-04

C8124-04

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

 2285
- +

Añadir

Investigación

 C8124-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
C8128-04

C8128-04

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

 2267
- +

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Investigación

 C8128-04

Datasheet

 Bulk Edge-Grip™, C81 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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