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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
820-AG10D-ES

820-AG10D-ES

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

 3074
- +

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Investigación

 820-AG10D-ES

Datasheet

 Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
5-1437539-8

5-1437539-8

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

 3170
- +

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Investigación

 5-1437539-8

Datasheet

 Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
5-1437542-2

5-1437542-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

 2626
- +

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Investigación

 5-1437542-2

Datasheet

 - 700 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
5-1437542-8

5-1437542-8

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

 3622
- +

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Investigación

 5-1437542-8

Datasheet

 - 700 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
6-1437531-6

6-1437531-6

CONN IC DIP SOCKET 18POS

TE Connectivity AMP Connectors

 2233
- +

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Investigación

 Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) - - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) - - Copper Alloy -
6-1437535-3

6-1437535-3

CONN SOCKET SIP 8POS GOLD

TE Connectivity AMP Connectors

 2296
- +

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Investigación

 6-1437535-3

Datasheet

 Tube 500 Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Thermoplastic
818-AG12D

818-AG12D

CONN IC DIP SOCKET 18POS TINLEAD

TE Connectivity AMP Connectors

 2782
- +

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Investigación

 818-AG12D

Datasheet

 Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
6-1437539-3

6-1437539-3

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

 3022
- +

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Investigación

 6-1437539-3

Datasheet

 Tube 800 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
6-1437542-2

6-1437542-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

 2765
- +

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Investigación

 6-1437542-2

Datasheet

 - 700 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
643640-6

643640-6

CONN SOCKET SIP 8POS TIN

TE Connectivity AMP Connectors

 2758
- +

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Investigación

 643640-6

Datasheet

 Tray Diplomate DL Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643642-2

643642-2

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

 3495
- +

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Investigación

 643642-2

Datasheet

 Tray Diplomate DL Obsolete SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
643644-8

643644-8

CONN SOCKET SIP 12POS TIN

TE Connectivity AMP Connectors

 3201
- +

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Investigación

 643644-8

Datasheet

 Tray Diplomate DL Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643645-6

643645-6

CONN SOCKET SIP 13POS TIN

TE Connectivity AMP Connectors

 3520
- +

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Investigación

 643645-6

Datasheet

 Tray Diplomate DL Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643647-6

643647-6

CONN SOCKET SIP 15POS TIN

TE Connectivity AMP Connectors

 3999
- +

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Investigación

 643647-6

Datasheet

 Tray Diplomate DL Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643647-8

643647-8

CONN SOCKET SIP 15POS TIN

TE Connectivity AMP Connectors

 3435
- +

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Investigación

 643647-8

Datasheet

 Tray Diplomate DL Obsolete SIP 15 (1 x 15) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643648-8

643648-8

CONN SOCKET SIP 16POS TIN

TE Connectivity AMP Connectors

 3176
- +

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Investigación

 643648-8

Datasheet

 Tray Diplomate DL Obsolete SIP 16 (1 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643650-6

643650-6

CONN SOCKET SIP 18POS TIN

TE Connectivity AMP Connectors

 3575
- +

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Investigación

 643650-6

Datasheet

 Tray Diplomate DL Obsolete SIP 18 (1 x 18) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643651-3

643651-3

CONN SOCKET SIP 19POS TIN

TE Connectivity AMP Connectors

 2346
- +

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Investigación

 643651-3

Datasheet

 Tray Diplomate DL Obsolete SIP 19 (1 x 19) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643655-6

643655-6

CONN SOCKET SIP 23POS TIN

TE Connectivity AMP Connectors

 3005
- +

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Investigación

 643655-6

Datasheet

 Tray Diplomate DL Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
7-1437532-8

7-1437532-8

CONN IC DIP SOCKET 40POS

TE Connectivity AMP Connectors

 3986
- +

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Investigación

 - 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) - - - Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) - - - -
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