España Hola! Bienvenido a visitar Шэньчжэньская микроэлектронная компания Хунтай !

Carrito de compras

Proyecto (S)
Catálogo de productos
Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
SIP1X16-041BLF

SIP1X16-041BLF

CONN SOCKET SIP 16POS GOLD

Amphenol ICC (FCI)

 3937
- +

Añadir

Investigación

 SIP1X16-041BLF

Datasheet

 Bulk SIP1x Obsolete SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
DPF316-998Z

DPF316-998Z

CONN IC DIP SOCKET 16POS TINLEAD

Amphenol ICC (FCI)

 2766
- +

Añadir

Investigación

 DPF316-998Z

Datasheet

 Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF314-998Z

DPF314-998Z

CONN IC DIP SOCKET 14POS TINLEAD

Amphenol ICC (FCI)

 2020
- +

Añadir

Investigación

 DPF314-998Z

Datasheet

 Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF308-998Z

DPF308-998Z

CONN IC DIP SOCKET 8POS TIN-LEAD

Amphenol ICC (FCI)

 3799
- +

Añadir

Investigación

 DPF308-998Z

Datasheet

 Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X02-041BLF

SIP1X02-041BLF

CONN SOCKET SIP 2POS GOLD

Amphenol ICC (FCI)

 2938
- +

Añadir

Investigación

 SIP1X02-041BLF

Datasheet

 Bulk SIP1x Obsolete SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
1-1747890-1

1-1747890-1

CONN SOCKET LGA 771POS GOLD

TE Connectivity AMP Connectors

 3291
- +

Añadir

Investigación

 1-1747890-1

Datasheet

 Tray - Obsolete LGA 771 (33 x 33) 0.043 (1.09mm) Gold - Copper Alloy Surface Mount Open Frame Solder 0.043 (1.09mm) - - - Thermoplastic
1735315-4

1735315-4

CONN SOCKET PGA ZIF 939POS GOLD

TE Connectivity AMP Connectors

 3642
- +

Añadir

Investigación

 1735315-4

Datasheet

 Tray - Obsolete PGA, ZIF (ZIP) 939 (31 x 31) 0.050 (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1871554-1

1871554-1

CONN SKT 1207-F RIGHT LEVER SMD

TE Connectivity AMP Connectors

 2621
- +

Añadir

Investigación

 1871554-1

Datasheet

 Bulk - Obsolete LGA 1207 (33 x 34) 0.043 (1.09mm) Gold - Copper Alloy Surface Mount Closed Frame Solder 0.043 (1.09mm) Gold - Copper Alloy Thermoplastic
1761503-1

1761503-1

CONN SOCKET PGA 940POS GOLD

TE Connectivity AMP Connectors

 2337
- +

Añadir

Investigación

 1761503-1

Datasheet

 Tray - Active PGA 940 (30 x 30) 0.050 (1.27mm) Gold 30.0µin (0.76µm) - Surface Mount Closed Frame - - - - - -
1-1903401-4

1-1903401-4

CONN SOCKET PGA 638POS GOLD

TE Connectivity AMP Connectors

 2759
- +

Añadir

Investigación

 1-1903401-4

Datasheet

 Tape & Reel (TR),Cut Tape (CT) - Obsolete PGA 638 (26 x 26) 0.050 (1.27mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.050 (1.27mm) Gold - Copper Alloy Thermoplastic
1674770-6

1674770-6

CONN SOCKET PGA ZIF 479POS GOLD

TE Connectivity AMP Connectors

 2783
- +

Añadir

Investigación

 1674770-6

Datasheet

 Tape & Reel (TR),Cut Tape (CT) - Obsolete PGA, ZIF (ZIP) 479 (26 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
8180-E1

8180-E1

CONN TRANSIST TO-3 4POS TIN

Aavid, Thermal Division of Boyd Corporation

 3640
- +

Añadir

Investigación

 8180-E1

Datasheet

 Bulk 8180 Active Transistor, TO-3 4 (Oval) - Tin - Steel Through Hole Closed Frame Solder - Tin - Steel Polyamide (PA), Nylon, Glass Filled
A28-LC-7-TT-R

A28-LC-7-TT-R

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

 3849
- +

Añadir

Investigación

 A28-LC-7-TT-R

Datasheet

 Box - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT)
MHAS-181-ZMGG-15

MHAS-181-ZMGG-15

CONN SOCKET BGA 181POS GOLD

Samtec Inc.

 2327
- +

Añadir

Investigación

 MHAS-181-ZMGG-15

Datasheet

 Bulk MHA Obsolete BGA 181 (15 x 15) 0.100 (2.54mm) Gold - - Through Hole Open Frame Solder 0.100 (2.54mm) Gold - - -
100-006-050

100-006-050

CONN IC DIP SOCKET 6POS GOLD

3M

 2086
- +

Añadir

Investigación

 100-006-050

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-008-050

100-008-050

CONN IC DIP SOCKET 8POS GOLD

3M

 3451
- +

Añadir

Investigación

 100-008-050

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-008-051

100-008-051

CONN IC DIP SOCKET 8POS GOLD

3M

 2994
- +

Añadir

Investigación

 100-008-051

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-010-050

100-010-050

CONN IC DIP SOCKET 10POS GOLD

3M

 2619
- +

Añadir

Investigación

 100-010-050

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-050

100-014-050

CONN IC DIP SOCKET 14POS GOLD

3M

 2112
- +

Añadir

Investigación

 100-014-050

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-051

100-014-051

CONN IC DIP SOCKET 14POS GOLD

3M

 2703
- +

Añadir

Investigación

 100-014-051

Datasheet

 Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 773774775776777778779780...1100Next»
Solicitud de cotización
Número de pieza
Cantidad
Contacto
Correo electrónico
Empresa
Comentarios