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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
8058-24G1

8058-24G1

CONN TRANSIST TO-5 10POS GOLD

TE Connectivity AMP Connectors

2727
- +

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Investigación

Bulk 8058 Obsolete Transistor, TO-5 10 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
9-1437508-4

9-1437508-4

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

2315
- +

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Investigación

Bulk 8058 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
6-6437504-2

6-6437504-2

CONN TRANSIST TO-3 3POS SILVER

TE Connectivity AMP Connectors

3396
- +

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Investigación

6-6437504-2

Datasheet

Bulk,Bulk 8080 Obsolete Transistor, TO-3 3 (Oval) - Silver - Beryllium Copper Chassis Mount Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP)
1-1747890-2

1-1747890-2

CONN SOCKET LGA 771POS GOLD

TE Connectivity AMP Connectors

2034
- +

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Investigación

1-1747890-2

Datasheet

Tray - Obsolete LGA 771 (33 x 33) 0.043 (1.09mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.043 (1.09mm) - - - Thermoplastic
1-2013620-3

1-2013620-3

CONN SOCKET PGA ZIF 988POS GOLD

TE Connectivity AMP Connectors

3980
- +

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Investigación

Tape & Reel (TR) - Obsolete PGA, ZIF (ZIP) 988 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
2013620-3

2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

3801
- +

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Investigación

Tape & Reel (TR),Box - Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
2040540-2

2040540-2

CONN SOCKET LGA 1156POS GOLD

TE Connectivity AMP Connectors

3065
- +

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Investigación

2040540-2

Datasheet

Tray,Box - Active LGA 1156 (34 x 34) 0.036 (0.91mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
WMS-100Z

WMS-100Z

CONN IC DIP SOCKET 10POS GOLD

On Shore Technology Inc.

3920
- +

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Investigación

WMS-100Z

Datasheet

Tube WMS Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass -
4842-6004-CP

4842-6004-CP

CONN IC DIP SOCKET 42POS TIN

3M

2405
- +

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Investigación

Bulk 4800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 135.0µin (3.43µm) Phosphor Bronze Polyester, Glass Filled
516-AG11D-ES

516-AG11D-ES

DIP SOCKET T/H 16POS

TE Connectivity AMP Connectors

2265
- +

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Investigación

516-AG11D-ES

Datasheet

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
0473370001

0473370001

CONN CAM SOCKET 24POS GOLD

Molex

2111
- +

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Investigación

0473370001

Datasheet

Tape & Reel (TR),Cut Tape (CT) 47337 Obsolete Camera Socket 24 (4 x 6) 0.035 (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Gold Flash Copper Alloy Polyamide (PA), Nylon
WMS-420Z

WMS-420Z

CONN IC DIP SOCKET 42POS GOLD

On Shore Technology Inc.

3759
- +

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Investigación

WMS-420Z

Datasheet

Tube WMS Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass -
WMS-480Z

WMS-480Z

CONN IC DIP SOCKET 48POS GOLD

On Shore Technology Inc.

2462
- +

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Investigación

WMS-480Z

Datasheet

Tube WMS Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass -
XR2C-2000-HSG

XR2C-2000-HSG

CONN IC SOCKET 20POS

Omron Electronics Inc-EMC Div

3035
- +

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Investigación

XR2C-2000-HSG

Datasheet

Bulk,Bulk XR2 Obsolete Housing 20 (1 x 20) 0.100 (2.54mm) - - Beryllium Copper - Closed Frame Solder 0.100 (2.54mm) - - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-3200-HSG

XR2C-3200-HSG

CONN IC SOCKET 32POS

Omron Electronics Inc-EMC Div

3790
- +

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Investigación

XR2C-3200-HSG

Datasheet

Bulk XR2 Active Housing 32 (1 x 32) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) - - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3205

XR2E-3205

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

3841
- +

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Investigación

XR2E-3205

Datasheet

Bulk XR2 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold - Beryllium Copper - - Solder 0.100 (2.54mm) Gold - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2D-2401-N

XR2D-2401-N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

3839
- +

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Investigación

XR2D-2401-N

Datasheet

Bulk XR2 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2D-4001-N

XR2D-4001-N

CONN IC DIP SOCKET 40POS GOLD

Omron Electronics Inc-EMC Div

3670
- +

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Investigación

XR2D-4001-N

Datasheet

Bulk XR2 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2E-3201-N

XR2E-3201-N

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

2832
- +

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Investigación

XR2E-3201-N

Datasheet

Bulk XR2 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
0479890112

0479890112

CONN SOCKET PGA 989POS GOLD

Molex

3150
- +

Añadir

Investigación

0479890112

Datasheet

Tray 47989 Obsolete PGA 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - - Liquid Crystal Polymer (LCP)
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