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| Photo | Mfr. Part # | Stock | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
8058-24G1CONN TRANSIST TO-5 10POS GOLD |
2727 |
AñadirInvestigación |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 10 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | |
|
|
9-1437508-4CONN TRANSIST TO-5 4POS GOLD |
2315 |
AñadirInvestigación |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | |
|
|
6-6437504-2CONN TRANSIST TO-3 3POS SILVER |
3396 |
AñadirInvestigación |
Datasheet |
Bulk,Bulk | 8080 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) |
|
|
1-1747890-2CONN SOCKET LGA 771POS GOLD |
2034 |
AñadirInvestigación |
Datasheet |
Tray | - | Obsolete | LGA | 771 (33 x 33) | 0.043 (1.09mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
|
|
1-2013620-3CONN SOCKET PGA ZIF 988POS GOLD |
3980 |
AñadirInvestigación |
Tape & Reel (TR) | - | Obsolete | PGA, ZIF (ZIP) | 988 (35 x 36) | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | Copper Alloy | Thermoplastic | |
|
|
2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
3801 |
AñadirInvestigación |
Tape & Reel (TR),Box | - | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | Copper Alloy | Thermoplastic | |
|
|
2040540-2CONN SOCKET LGA 1156POS GOLD |
3065 |
AñadirInvestigación |
Datasheet |
Tray,Box | - | Active | LGA | 1156 (34 x 34) | 0.036 (0.91mm) | Gold | Flash | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.039 (1.00mm) | - | - | Copper Alloy | Thermoplastic |
|
|
WMS-100ZCONN IC DIP SOCKET 10POS GOLD |
3920 |
AñadirInvestigación |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
4842-6004-CPCONN IC DIP SOCKET 42POS TIN |
2405 |
AñadirInvestigación |
Bulk | 4800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 135.0µin (3.43µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 135.0µin (3.43µm) | Phosphor Bronze | Polyester, Glass Filled | |
|
|
516-AG11D-ESDIP SOCKET T/H 16POS |
2265 |
AñadirInvestigación |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
0473370001CONN CAM SOCKET 24POS GOLD |
2111 |
AñadirInvestigación |
Datasheet |
Tape & Reel (TR),Cut Tape (CT) | 47337 | Obsolete | Camera Socket | 24 (4 x 6) | 0.035 (0.90mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Gold | Flash | Copper Alloy | Polyamide (PA), Nylon |
|
|
WMS-420ZCONN IC DIP SOCKET 42POS GOLD |
3759 |
AñadirInvestigación |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
|
WMS-480ZCONN IC DIP SOCKET 48POS GOLD |
2462 |
AñadirInvestigación |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
|
XR2C-2000-HSGCONN IC SOCKET 20POS |
3035 |
AñadirInvestigación |
Datasheet |
Bulk,Bulk | XR2 | Obsolete | Housing | 20 (1 x 20) | 0.100 (2.54mm) | - | - | Beryllium Copper | - | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-3200-HSGCONN IC SOCKET 32POS |
3790 |
AñadirInvestigación |
Datasheet |
Bulk | XR2 | Active | Housing | 32 (1 x 32) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2E-3205CONN SOCKET SIP 32POS GOLD |
3841 |
AñadirInvestigación |
Datasheet |
Bulk | XR2 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | - | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2D-2401-NCONN IC DIP SOCKET 24POS GOLD |
3839 |
AñadirInvestigación |
Datasheet |
Bulk | XR2 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2D-4001-NCONN IC DIP SOCKET 40POS GOLD |
3670 |
AñadirInvestigación |
Datasheet |
Bulk | XR2 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2E-3201-NCONN SOCKET SIP 32POS GOLD |
2832 |
AñadirInvestigación |
Datasheet |
Bulk | XR2 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
0479890112CONN SOCKET PGA 989POS GOLD |
3150 |
AñadirInvestigación |
Datasheet |
Tray | 47989 | Obsolete | PGA | 989 (35 x 36) | 0.039 (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) |
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