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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
540-88-084-17-400-TR

540-88-084-17-400-TR

CONN SOCKET PLCC 84POS TIN

Preci-Dip

2647
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Investigación

540-88-084-17-400-TR

Datasheet

Tape & Reel (TR) 540 Obsolete PLCC 84 (4 x 21) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
1051420133

1051420133

CONN SOCKET LGA 2011POS GOLD

Molex

3239
- +

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Investigación

1051420133

Datasheet

Tray 105142 Obsolete LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) - - - Thermoplastic
1109253

1109253

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2252
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Investigación

- - Active - - - - - - - - - - - - - -
1110729-24

1110729-24

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

3545
- +

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Investigación

- - Active - - - - - - - - - - - - - -
7410-101-10

7410-101-10

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2968
- +

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Investigación

- - Active - - - - - - - - - - - - - -
28-6553-16

28-6553-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2206
- +

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Investigación

28-6553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
1109927-28

1109927-28

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2126
- +

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Investigación

- - Active - - - - - - - - - - - - - -
1109906-40

1109906-40

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2010
- +

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Investigación

- - Active - - - - - - - - - - - - - -
1108254-48

1108254-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

3674
- +

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Investigación

- - Active - - - - - - - - - - - - - -
1109906-48

1109906-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2340
- +

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Investigación

- - Active - - - - - - - - - - - - - -
1109927-48

1109927-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2678
- +

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Investigación

- - Active - - - - - - - - - - - - - -
1107871-48

1107871-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

2369
- +

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Investigación

- - Active - - - - - - - - - - - - - -
1109741-48

1109741-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

3813
- +

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Investigación

- - Active - - - - - - - - - - - - - -
68-PLS13117-16

68-PLS13117-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3956
- +

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Investigación

68-PLS13117-16

Datasheet

Bulk PLS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
68-PRS13117-16

68-PRS13117-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2341
- +

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Investigación

68-PRS13117-16

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PLS15031-16

100-PLS15031-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3839
- +

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Investigación

100-PLS15031-16

Datasheet

Bulk PLS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PRS15031-16

100-PRS15031-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2169
- +

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Investigación

100-PRS15031-16

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
114-PRS13021-16

114-PRS13021-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3330
- +

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Investigación

114-PRS13021-16

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
144-PLS15026-16

144-PLS15026-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2144
- +

Añadir

Investigación

144-PLS15026-16

Datasheet

Bulk PLS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
144-PRS15026-16

144-PRS15026-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2731
- +

Añadir

Investigación

144-PRS15026-16

Datasheet

Bulk PRS Obsolete PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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