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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
233-PGM18039-51

233-PGM18039-51

CONN SOCKET PGA GOLD

Aries Electronics

 2061
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 233-PGM18039-51

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
256-PG16001-10H

256-PG16001-10H

CONN SOCKET PGA GOLD

Aries Electronics

 3753
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 256-PG16001-10H

Datasheet

 Bulk PG Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
257-PGM20012-10

257-PGM20012-10

CONN SOCKET PGA GOLD

Aries Electronics

 2581
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 257-PGM20012-10

Datasheet

 Bulk PGM Obsolete PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-14

1109800-14

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 3645
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 1109800-14

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-16

1109800-16

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

 2485
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 1109800-16

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-18

1109800-18

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

 3490
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 1109800-18

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-20

1109800-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

 3993
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 1109800-20

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-28

1109800-28

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

 3496
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 1109800-28

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-10

1109800-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

 3502
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Investigación

 1109800-10

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-12

1109800-12

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

 3023
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Investigación

 1109800-12

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-22

1109800-22

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

 2606
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Investigación

 1109800-22

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-24

1109800-24

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 3964
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Investigación

 1109800-24

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-26

1109800-26

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

 2002
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Investigación

 1109800-26

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-8

1109800-8

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

 2116
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Investigación

 1109800-8

Datasheet

 Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-308

1109681-308

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

 2577
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Investigación

 1109681-308

Datasheet

 Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-314

1109681-314

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

 2534
- +

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Investigación

 1109681-314

Datasheet

 Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-316

1109681-316

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

 2938
- +

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Investigación

 1109681-316

Datasheet

 Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-318

1109681-318

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

 3089
- +

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Investigación

 1109681-318

Datasheet

 Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-320

1109681-320

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

 2632
- +

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Investigación

 1109681-320

Datasheet

 Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-324

1109681-324

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 3893
- +

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Investigación

 1109681-324

Datasheet

 Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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