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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-43-652-41-003000

612-43-652-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2614
- +

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612-43-652-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-652-41-003000

612-93-652-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2461
- +

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612-93-652-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-264-41-001000

714-93-264-41-001000

SOCKET CARRIER DUAL INLINE 64POS

Mill-Max Manufacturing Corp.

2462
- +

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714-93-264-41-001000

Datasheet

Tube 714 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
322-93-164-41-001000

322-93-164-41-001000

SOCKET 2 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

2928
- +

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322-93-164-41-001000

Datasheet

Tube 322 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-428-61-001000

110-41-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3253
- +

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Tube * Active - - - - - - - - - - - - - -
110-91-328-61-001000

110-91-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3481
- +

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Tube * Active - - - - - - - - - - - - - -
110-91-428-61-001000

110-91-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3645
- +

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Tube * Active - - - - - - - - - - - - - -
115-44-420-61-003000

115-44-420-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3785
- +

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Tube * Active - - - - - - - - - - - - - -
517-83-321-19-121111

517-83-321-19-121111

CONN SOCKET PGA 321POS GOLD

Preci-Dip

3987
- +

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517-83-321-19-121111

Datasheet

Bulk 517 Active PGA 321 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-964-31-002000

614-41-964-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2583
- +

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614-41-964-31-002000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-964-31-002000

614-91-964-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2952
- +

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614-91-964-31-002000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
712-93-164-41-001000

712-93-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

3011
- +

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712-93-164-41-001000

Datasheet

Tube 712 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-316-61-001000

115-43-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2199
- +

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Tube * Active - - - - - - - - - - - - - -
115-93-316-61-001000

115-93-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3964
- +

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Tube * Active - - - - - - - - - - - - - -
18-810-90T

18-810-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3222
- +

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18-810-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
40-3574-10

40-3574-10

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

2220
- +

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40-3574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6570-10

40-6570-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3430
- +

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40-6570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6572-10

40-6572-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2493
- +

Add To Cart

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40-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3570-10

40-3570-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2176
- +

Add To Cart

Inquiry Now

40-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3571-10

40-3571-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3401
- +

Add To Cart

Inquiry Now

40-3571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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