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| Photo | Mfr. Part # | Stock | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
123-91-950-41-001000SOCKET IC OPEN 3 LVL .900 50POS |
3908 |
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Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
123-41-950-41-001000CONN IC SKT DBL |
3141 |
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Datasheet |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-255M16-001166BGA PIN ADAPTER 1.27MM SMD |
3982 |
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Datasheet |
Bulk | 550 | Active | BGA | 255 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
115-43-320-61-003000CONN IC SKT DBL |
2485 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-93-320-61-003000CONN IC SKT DBL |
2482 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-44-328-61-003000CONN IC SKT DBL |
2954 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-44-628-61-003000CONN IC SKT DBL |
3325 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-43-322-61-001000CONN IC SKT DBL |
3762 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-322-61-001000CONN IC SKT DBL |
2837 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
612-43-952-41-003000SKT CARRIER SOLDRTL |
2898 |
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Datasheet |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-93-952-41-003000SKT CARRIER SOLDRTL |
3980 |
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Datasheet |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-41-952-41-002000CONN IC SKT DBL |
3205 |
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Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-91-952-41-002000CONN IC SKT DBL |
2086 |
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Datasheet |
Tube | 126 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8080-1G9CONN TRANSIST TO-3 4POS GOLD |
2813 |
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Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) |
|
|
APA-324-G-QADAPTER PLUG |
3806 |
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Tube | APA | Active | - | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
APA-624-G-QADAPTER PLUG |
2592 |
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Tube | APA | Active | - | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
104-13-952-41-780000CONN IC DIP SOCKET 52POS GOLD |
3544 |
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Datasheet |
Tube | 104 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Thermoplastic |
|
|
110-43-316-61-605000CONN IC SKT DBL |
3941 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-316-61-605000CONN IC SKT DBL |
3074 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
1109310-48SER X55X UNIV ZIF DIP TST SCKT |
3549 |
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- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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