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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-43-177-15-061002

510-43-177-15-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3995
- +

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510-43-177-15-061002

Datasheet

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
518-77-272M20-001106

518-77-272M20-001106

CONN SOCKET PGA 272POS GOLD

Preci-Dip

2728
- +

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518-77-272M20-001106

Datasheet

Bulk 518 Active PGA 272 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
42-3570-11

42-3570-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3655
- +

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42-3570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3571-11

42-3571-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

2089
- +

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42-3571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3572-11

42-3572-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3481
- +

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42-3572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3573-11

42-3573-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3138
- +

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42-3573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3574-11

42-3574-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3247
- +

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42-3574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3575-11

42-3575-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2820
- +

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42-3575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6570-11

42-6570-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

2359
- +

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42-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6571-11

42-6571-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3336
- +

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42-6571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6572-11

42-6572-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3604
- +

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42-6572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6573-11

42-6573-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2009
- +

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42-6573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6574-11

42-6574-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3235
- +

Add To Cart

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42-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6575-11

42-6575-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2149
- +

Add To Cart

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42-6575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
546-87-403-19-111147

546-87-403-19-111147

CONN SOCKET PGA 403POS GOLD

Preci-Dip

3041
- +

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546-87-403-19-111147

Datasheet

Bulk 546 Active PGA 403 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-381-18-101135

550-80-381-18-101135

PGA SOLDER TAIL

Preci-Dip

2756
- +

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550-80-381-18-101135

Datasheet

Bulk 550 Active PGA 381 (18 x 18) 0.050 (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-43-181-15-041002

510-43-181-15-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2658
- +

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510-43-181-15-041002

Datasheet

Tube 510 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-320-19-131147

546-83-320-19-131147

CONN SOCKET PGA 320POS GOLD

Preci-Dip

3022
- +

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546-83-320-19-131147

Datasheet

Bulk 546 Active PGA 320 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-196-14-000002

510-93-196-14-000002

SOCKET SOLDERTAIL 196-PGA

Mill-Max Manufacturing Corp.

3138
- +

Add To Cart

Inquiry Now

Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-196-14-000001

510-93-196-14-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2622
- +

Add To Cart

Inquiry Now

510-93-196-14-000001

Datasheet

Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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