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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
40-6508-312 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3262	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-41-240-17-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3964	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	240 (17 x 17)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-240-17-061002 SOCKET SOLDERTAIL 240-PGA Mill-Max Manufacturing Corp.	2033	- + Add To Cart Inquiry Now		Bulk	510	Active	PGA	240 (17 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-240-17-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2273	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	240 (17 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-240-17-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3266	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	240 (17 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-241-18-075001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3510	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	241 (18 x 18)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-241-18-075002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3755	- + Add To Cart Inquiry Now	Datasheet	Tube	510	Active	PGA	241 (18 x 18)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-241-18-075003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2241	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	241 (18 x 18)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-109-12-051001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3943	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	109 (12 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-109-12-051002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2992	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	109 (12 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-109-12-051003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3130	- + Add To Cart Inquiry Now	Datasheet	Bulk	510	Active	PGA	109 (12 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6508-21 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	2673	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-31 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	3977	- + Add To Cart Inquiry Now	Datasheet	Bulk	508	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
44-3570-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	3866	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3571-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	3396	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3572-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	3385	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3573-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	2737	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3574-11 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	3531	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3575-11 CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics	3444	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6570-11 CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics	2627	- + Add To Cart Inquiry Now	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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