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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-93-316-61-801000

110-93-316-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3586
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
104-11-432-41-780000

104-11-432-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3835
- +

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Investigación

 104-11-432-41-780000

Datasheet

 Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-632-41-780000

104-11-632-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2416
- +

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Investigación

 104-11-632-41-780000

Datasheet

 Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-320-G-Q

APA-320-G-Q

ADAPTER PLUG

Samtec Inc.

 2575
- +

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Investigación

 Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
605-41-648-11-480000

605-41-648-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

 3627
- +

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Investigación

 605-41-648-11-480000

Datasheet

 Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-648-11-480000

605-91-648-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

 2412
- +

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Investigación

 605-91-648-11-480000

Datasheet

 Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-328-41-780000

104-13-328-41-780000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 3178
- +

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Investigación

 104-13-328-41-780000

Datasheet

 Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-428-41-780000

104-13-428-41-780000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 2653
- +

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Investigación

 104-13-428-41-780000

Datasheet

 Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-628-41-780000

104-13-628-41-780000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 3729
- +

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Investigación

 104-13-628-41-780000

Datasheet

 Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
116-41-650-41-008000

116-41-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2690
- +

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Investigación

 116-41-650-41-008000

Datasheet

 Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-650-41-008000

116-91-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2260
- +

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Investigación

 116-91-650-41-008000

Datasheet

 Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-432-31-002000

614-41-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 3229
- +

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Investigación

 614-41-432-31-002000

Datasheet

 Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-632-31-002000

614-41-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 3368
- +

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Investigación

 614-41-632-31-002000

Datasheet

 Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-648-41-001000

123-41-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3150
- +

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Investigación

 123-41-648-41-001000

Datasheet

 Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
322-13-120-41-001000

322-13-120-41-001000

SOCKET 2 LEVEL WRAPOST SIP 20POS

Mill-Max Manufacturing Corp.

 3646
- +

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Investigación

 322-13-120-41-001000

Datasheet

 Tube 322 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-0508-20

40-0508-20

CONN SOCKET SIP 40POS GOLD

Aries Electronics

 2782
- +

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Investigación

 40-0508-20

Datasheet

 Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-0508-30

40-0508-30

CONN SOCKET SIP 40POS GOLD

Aries Electronics

 2970
- +

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Investigación

 40-0508-30

Datasheet

 Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
123-11-322-41-001000

123-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2506
- +

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Investigación

 123-11-322-41-001000

Datasheet

 Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-422-41-001000

123-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3618
- +

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Investigación

 123-11-422-41-001000

Datasheet

 Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-964-41-001000

210-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2572
- +

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Investigación

 210-11-964-41-001000

Datasheet

 Tube 210 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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