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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-43-668-41-105000

117-43-668-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2245
- +

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Investigación

 117-43-668-41-105000

Datasheet

 Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-648-61-001000

110-41-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2803
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
110-91-648-61-001000

110-91-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3282
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
110-43-322-61-105000

110-43-322-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3999
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
110-43-422-61-105000

110-43-422-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2149
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
42-6571-10

42-6571-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 2750
- +

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Investigación

 42-6571-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6572-10

42-6572-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 3301
- +

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Investigación

 42-6572-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6573-10

42-6573-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 2257
- +

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Investigación

 42-6573-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6574-10

42-6574-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 3379
- +

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Investigación

 42-6574-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6575-10

42-6575-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 2126
- +

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Investigación

 42-6575-10

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
517-87-545-17-000111

517-87-545-17-000111

CONN SOCKET PGA 545POS GOLD

Preci-Dip

 2491
- +

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Investigación

 517-87-545-17-000111

Datasheet

 Bulk 517 Active PGA 545 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
127-93-764-41-002000

127-93-764-41-002000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

 2079
- +

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Investigación

 127-93-764-41-002000

Datasheet

 Tube 127 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-764-41-002000

127-43-764-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2920
- +

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Investigación

 127-43-764-41-002000

Datasheet

 Tube 127 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-632-61-605000

110-43-632-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2364
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
110-93-632-61-605000

110-93-632-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 3061
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
42-3553-10

42-3553-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 2213
- +

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Investigación

 42-3553-10

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6551-10

42-6551-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 3883
- +

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Investigación

 42-6551-10

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6552-10

42-6552-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 2776
- +

Añadir

Investigación

 42-6552-10

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6553-10

42-6553-10

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

 2232
- +

Añadir

Investigación

 42-6553-10

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3554-10

42-3554-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 2829
- +

Añadir

Investigación

 42-3554-10

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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