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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-41-636-61-001000

110-41-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2885
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Investigación

 Tube * Active - - - - - - - - - - - - - -
110-91-636-61-001000

110-91-636-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 2539
- +

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Investigación

 Tube * Active - - - - - - - - - - - - - -
35-71000-10

35-71000-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

 2042
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Investigación

 35-71000-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-7360-10

35-7360-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

 2590
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 35-7360-10

Datasheet

 Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-823-90C

40-823-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 2827
- +

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Investigación

 40-823-90C

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-13-648-41-001000

122-13-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

 2363
- +

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 122-13-648-41-001000

Datasheet

 Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-952-41-001000

116-47-952-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

 3335
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 116-47-952-41-001000

Datasheet

 Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-820-90C

40-820-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 3587
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Investigación

 40-820-90C

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-822-90C

40-822-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 3929
- +

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Investigación

 40-822-90C

Datasheet

 Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6574-11

24-6574-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

 2886
- +

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Investigación

 24-6574-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6571-11

24-6571-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 2642
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Investigación

 24-6571-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3571-11

24-3571-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 2551
- +

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Investigación

 24-3571-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3572-11

24-3572-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 2830
- +

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Investigación

 24-3572-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3573-11

24-3573-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 2495
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Investigación

 24-3573-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3574-11

24-3574-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

 3985
- +

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Investigación

 24-3574-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6572-11

24-6572-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 2443
- +

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Investigación

 24-6572-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6570-11

24-6570-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 2258
- +

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Investigación

 24-6570-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3570-11

24-3570-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 3962
- +

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Investigación

 24-3570-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6573-11

24-6573-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 3033
- +

Añadir

Investigación

 24-6573-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3575-11

24-3575-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

 3283
- +

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Investigación

 24-3575-11

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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