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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-441-21-000002

510-91-441-21-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2094
- +

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Investigación

 510-91-441-21-000002

Datasheet

 Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-441-21-000003

510-91-441-21-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3303
- +

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Investigación

 510-91-441-21-000003

Datasheet

 Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
239-5605-01-0602

239-5605-01-0602

CONN ZIG-ZAG 39POS GOLD

3M

 2233
- +

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Investigación

 239-5605-01-0602

Datasheet

 Bulk - Active Zig-Zag 39 (1 x 19, 1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
514-87-560M33-001148

514-87-560M33-001148

CONN SOCKET BGA 560POS GOLD

Preci-Dip

 3256
- +

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Investigación

 514-87-560M33-001148

Datasheet

 Bulk 514 Active BGA 560 (33 x 33) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
48-6508-21

48-6508-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

 3580
- +

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Investigación

 48-6508-21

Datasheet

 Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6508-31

48-6508-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

 2134
- +

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Investigación

 48-6508-31

Datasheet

 Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-420M26-001101

558-10-420M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 3930
- +

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Investigación

 558-10-420M26-001101

Datasheet

 Bulk 558 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
40-3574-16

40-3574-16

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 3248
- +

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Investigación

 40-3574-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6574-16

40-6574-16

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 2448
- +

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Investigación

 40-6574-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3570-16

40-3570-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 2498
- +

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Investigación

 40-3570-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
40-3571-16

40-3571-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 3147
- +

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Investigación

 40-3571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
40-3572-16

40-3572-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 2238
- +

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Investigación

 40-3572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
40-3573-16

40-3573-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 3751
- +

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Investigación

 40-3573-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
40-3575-16

40-3575-16

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

 2041
- +

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Investigación

 40-3575-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6570-16

40-6570-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 2952
- +

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Investigación

 40-6570-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
40-6571-16

40-6571-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 2636
- +

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Investigación

 40-6571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
40-6572-16

40-6572-16

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 2325
- +

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Investigación

 40-6572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6573-16

40-6573-16

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 3715
- +

Añadir

Investigación

 40-6573-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6575-16

40-6575-16

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 3601
- +

Añadir

Investigación

 40-6575-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
518-77-388M26-001106

518-77-388M26-001106

CONN SOCKET PGA 388POS GOLD

Preci-Dip

 2860
- +

Añadir

Investigación

 518-77-388M26-001106

Datasheet

 Bulk 518 Active PGA 388 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
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