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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
180-PGM18007-41

180-PGM18007-41

CONN SOCKET PGA GOLD

Aries Electronics

 3498
- +

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Investigación

 180-PGM18007-41

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-400M20-000104

558-10-400M20-000104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

 2909
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Investigación

 558-10-400M20-000104

Datasheet

 Bulk 558 Active BGA 400 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-400M20-000105

518-77-400M20-000105

CONN SOCKET PGA 400POS GOLD

Preci-Dip

 2052
- +

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Investigación

 518-77-400M20-000105

Datasheet

 Bulk 518 Active PGA 400 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-456M26-001148

514-83-456M26-001148

CONN SOCKET BGA 456POS GOLD

Preci-Dip

 3533
- +

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Investigación

 514-83-456M26-001148

Datasheet

 Bulk 514 Active BGA 456 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-209-17-081001

510-13-209-17-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3510
- +

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Investigación

 510-13-209-17-081001

Datasheet

 Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-209-17-081002

510-13-209-17-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2951
- +

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Investigación

 510-13-209-17-081002

Datasheet

 Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-209-17-081003

510-13-209-17-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2224
- +

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Investigación

 510-13-209-17-081003

Datasheet

 Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-456M26-001152

550-10-456M26-001152

BGA SOLDER TAIL

Preci-Dip

 2265
- +

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Investigación

 550-10-456M26-001152

Datasheet

 Bulk 550 Active BGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-576M30-001148

514-87-576M30-001148

CONN SOCKET BGA 576POS GOLD

Preci-Dip

 2657
- +

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Investigación

 514-87-576M30-001148

Datasheet

 Bulk 514 Active BGA 576 (30 x 30) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-432M31-001101

558-10-432M31-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 2487
- +

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Investigación

 558-10-432M31-001101

Datasheet

 Bulk 558 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
28-6554-16

28-6554-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2463
- +

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Investigación

 28-6554-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3551-16

28-3551-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2856
- +

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Investigación

 28-3551-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3553-16

28-3553-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2890
- +

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Investigación

 28-3553-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6551-16

28-6551-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 3884
- +

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Investigación

 28-6551-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6552-16

28-6552-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

 2748
- +

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Investigación

 28-6552-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3554-16

28-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 2087
- +

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Investigación

 28-3554-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
518-77-400M20-000106

518-77-400M20-000106

CONN SOCKET PGA 400POS GOLD

Preci-Dip

 2193
- +

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Investigación

 518-77-400M20-000106

Datasheet

 Bulk 518 Active PGA 400 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
200-6310-9UN-1900

200-6310-9UN-1900

CONN SOCKET PGA ZIF 100POS GOLD

3M

 2703
- +

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Investigación

 200-6310-9UN-1900

Datasheet

 Bulk Textool™ Obsolete PGA, ZIF (ZIP) 100 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
510-93-400-20-000001

510-93-400-20-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2934
- +

Añadir

Investigación

 510-93-400-20-000001

Datasheet

 Bulk 510 Active PGA 400 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-400-20-000002

510-93-400-20-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2564
- +

Añadir

Investigación

 510-93-400-20-000002

Datasheet

 Bulk 510 Active PGA 400 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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