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Mfr. Part #	Stock	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
40-3551-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3564	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3552-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2744	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3553-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3027	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6551-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2905	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6552-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3442	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-6553-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2496	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-3554-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2155	- + Añadir Investigación	Datasheet	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
64-9508-21 CONN IC DIP SOCKET 64POS GOLD Aries Electronics	3285	- + Añadir Investigación	Datasheet	Bulk	508	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
64-9508-31 CONN IC DIP SOCKET 64POS GOLD Aries Electronics	3963	- + Añadir Investigación	Datasheet	Bulk	508	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-600M35-001152 BGA SOLDER TAIL Preci-Dip	3957	- + Añadir Investigación	Datasheet	Bulk	550	Active	BGA	600 (35 x 35)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-576M30-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	3898	- + Añadir Investigación	Datasheet	Bulk	558	Active	PGA	576 (30 x 30)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
510-13-323-21-005001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3619	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	323 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-323-21-005002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2399	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	323 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-323-21-005003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3139	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	323 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-324-18-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2499	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	324 (18 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-324-18-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3079	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	324 (18 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-324-18-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3895	- + Añadir Investigación	Datasheet	Bulk	510	Active	PGA	324 (18 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
15-PRS15068-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2241	- + Añadir Investigación	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
18-PLS15071-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3521	- + Añadir Investigación	Datasheet	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
18-PRS15071-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2879	- + Añadir Investigación	Datasheet	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)

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