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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-256-16-000001

510-13-256-16-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2200
- +

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Investigación

510-13-256-16-000001

Datasheet

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-256-16-000003

510-13-256-16-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2146
- +

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Investigación

510-13-256-16-000003

Datasheet

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-256-19-081001

510-13-256-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2130
- +

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Investigación

510-13-256-19-081001

Datasheet

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-256-19-081002

510-13-256-19-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2212
- +

Añadir

Investigación

510-13-256-19-081002

Datasheet

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-256-19-081003

510-13-256-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2669
- +

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Investigación

510-13-256-19-081003

Datasheet

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-520M31-001152

550-10-520M31-001152

BGA SOLDER TAIL

Preci-Dip

2709
- +

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Investigación

550-10-520M31-001152

Datasheet

Bulk 550 Active BGA 520 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-559-22-131147

546-83-559-22-131147

CONN SOCKET PGA 559POS GOLD

Preci-Dip

3538
- +

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Investigación

546-83-559-22-131147

Datasheet

Bulk 546 Active PGA 559 (22 x 22) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-361-18-101135

550-80-361-18-101135

PGA SOLDER TAIL

Preci-Dip

3561
- +

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Investigación

550-80-361-18-101135

Datasheet

Bulk 550 Active PGA 361 (18 x 18) 0.050 (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-456M26-001106

518-77-456M26-001106

CONN SOCKET PGA 456POS GOLD

Preci-Dip

3194
- +

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Investigación

518-77-456M26-001106

Datasheet

Bulk 518 Active PGA 456 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
48-3574-16

48-3574-16

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3288
- +

Añadir

Investigación

48-3574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6574-16

48-6574-16

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2857
- +

Añadir

Investigación

48-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3570-16

48-3570-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2423
- +

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Investigación

48-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
48-3571-16

48-3571-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3541
- +

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Investigación

48-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
48-3572-16

48-3572-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2436
- +

Añadir

Investigación

48-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
48-3573-16

48-3573-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3559
- +

Añadir

Investigación

48-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
48-3575-16

48-3575-16

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2486
- +

Añadir

Investigación

48-3575-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6570-16

48-6570-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3755
- +

Añadir

Investigación

48-6570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
48-6571-16

48-6571-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3316
- +

Añadir

Investigación

48-6571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
48-6572-16

48-6572-16

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3314
- +

Añadir

Investigación

48-6572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6573-16

48-6573-16

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2624
- +

Añadir

Investigación

48-6573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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