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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-441-21-000003

510-93-441-21-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3871
- +

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Investigación

 510-93-441-21-000003

Datasheet

 Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-83-500M30-001148

514-83-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

 2107
- +

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Investigación

 514-83-500M30-001148

Datasheet

 Bulk 514 Active BGA 500 (30 x 30) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-432M31-001106

518-77-432M31-001106

CONN SOCKET PGA 432POS GOLD

Preci-Dip

 2922
- +

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Investigación

 518-77-432M31-001106

Datasheet

 Bulk 518 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-13-240-17-061001

510-13-240-17-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2288
- +

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Investigación

 510-13-240-17-061001

Datasheet

 Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-240-17-061002

510-13-240-17-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2676
- +

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Investigación

 510-13-240-17-061002

Datasheet

 Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-240-17-061003

510-13-240-17-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2516
- +

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Investigación

 510-13-240-17-061003

Datasheet

 Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-241-18-075001

510-13-241-18-075001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2552
- +

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Investigación

 510-13-241-18-075001

Datasheet

 Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-241-18-075003

510-13-241-18-075003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3212
- +

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Investigación

 510-13-241-18-075003

Datasheet

 Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-241-18-075002

510-13-241-18-075002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2405
- +

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Investigación

 510-13-241-18-075002

Datasheet

 Tube 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
169-PGM13001-51

169-PGM13001-51

CONN SOCKET PGA GOLD

Aries Electronics

 2388
- +

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Investigación

 169-PGM13001-51

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-83-504M29-001148

514-83-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

 2726
- +

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Investigación

 514-83-504M29-001148

Datasheet

 Bulk 514 Active BGA 504 (29 x 29) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-500M30-001152

550-10-500M30-001152

BGA SOLDER TAIL

Preci-Dip

 2465
- +

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Investigación

 550-10-500M30-001152

Datasheet

 Bulk 550 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-504M29-001152

550-10-504M29-001152

BGA SOLDER TAIL

Preci-Dip

 2147
- +

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Investigación

 550-10-504M29-001152

Datasheet

 Bulk 550 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-478M26-131101

558-10-478M26-131101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 3339
- +

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Investigación

 558-10-478M26-131101

Datasheet

 Bulk 558 Active PGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
32-3551-16

32-3551-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 2256
- +

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Investigación

 32-3551-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3552-16

32-3552-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 3262
- +

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Investigación

 32-3552-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3553-16

32-3553-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 3540
- +

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Investigación

 32-3553-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6551-16

32-6551-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 3918
- +

Añadir

Investigación

 32-6551-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6552-16

32-6552-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 2966
- +

Añadir

Investigación

 32-6552-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6553-16

32-6553-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 3079
- +

Añadir

Investigación

 32-6553-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
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