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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-3554-16

32-3554-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 2496
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Investigación

 32-3554-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
558-10-480M29-001101

558-10-480M29-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 3245
- +

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Investigación

 558-10-480M29-001101

Datasheet

 Bulk 558 Active PGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
44-3570-16

44-3570-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

 2736
- +

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Investigación

 44-3570-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
44-3571-16

44-3571-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

 3943
- +

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Investigación

 44-3571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
44-3572-16

44-3572-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

 3508
- +

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Investigación

 44-3572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
44-3574-16

44-3574-16

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

 3709
- +

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Investigación

 44-3574-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3575-16

44-3575-16

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

 2023
- +

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Investigación

 44-3575-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6570-16

44-6570-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

 2989
- +

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Investigación

 44-6570-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
44-6571-16

44-6571-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

 2873
- +

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Investigación

 44-6571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
44-6572-16

44-6572-16

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

 3399
- +

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Investigación

 44-6572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6573-16

44-6573-16

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

 2376
- +

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Investigación

 44-6573-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6574-16

44-6574-16

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

 3685
- +

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Investigación

 44-6574-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6575-16

44-6575-16

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

 3297
- +

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Investigación

 44-6575-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6556-40

42-6556-40

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

 3430
- +

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Investigación

 42-6556-40

Datasheet

 Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
558-10-456M26-001104

558-10-456M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

 3258
- +

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Investigación

 558-10-456M26-001104

Datasheet

 Bulk 558 Active BGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-456M26-001105

518-77-456M26-001105

CONN SOCKET PGA 456POS GOLD

Preci-Dip

 3998
- +

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Investigación

 518-77-456M26-001105

Datasheet

 Bulk 518 Active PGA 456 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
179-PGM15011-10H

179-PGM15011-10H

CONN SOCKET PGA GOLD

Aries Electronics

 2219
- +

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Investigación

 179-PGM15011-10H

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-83-520M31-001148

514-83-520M31-001148

CONN SOCKET BGA 520POS GOLD

Preci-Dip

 3102
- +

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Investigación

 514-83-520M31-001148

Datasheet

 Bulk 514 Active BGA 520 (31 x 31) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-652M35-001148

514-87-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip

 2851
- +

Añadir

Investigación

 514-87-652M35-001148

Datasheet

 Bulk 514 Active BGA 652 (35 x 35) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-256-16-000002

510-13-256-16-000002

SOCKET SOLDERTAIL 256-PGA

Mill-Max Manufacturing Corp.

 2951
- +

Añadir

Investigación

 Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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