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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
546-87-529-21-121147

546-87-529-21-121147

CONN SOCKET PGA 529POS GOLD

Preci-Dip

3955
- +

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Investigación

546-87-529-21-121147

Datasheet

Bulk 546 Active PGA 529 (21 x 21) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-545-17-000147

546-87-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip

3070
- +

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Investigación

546-87-545-17-000147

Datasheet

Bulk 546 Active PGA 545 (17 x 17) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-419-19-111147

546-83-419-19-111147

CONN SOCKET PGA 419POS GOLD

Preci-Dip

3482
- +

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Investigación

546-83-419-19-111147

Datasheet

Bulk 546 Active PGA 419 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-560M33-001166

550-10-560M33-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

2201
- +

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Investigación

550-10-560M33-001166

Datasheet

Bulk 550 Active BGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
60-9503-21

60-9503-21

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

2559
- +

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Investigación

60-9503-21

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
60-9503-31

60-9503-31

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

2192
- +

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Investigación

60-9503-31

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
546-83-420-19-111147

546-83-420-19-111147

CONN SOCKET PGA 420POS GOLD

Preci-Dip

3284
- +

Añadir

Investigación

546-83-420-19-111147

Datasheet

Bulk 546 Active PGA 420 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-PGM13040-51

114-PGM13040-51

CONN SOCKET PGA GOLD

Aries Electronics

3845
- +

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Investigación

114-PGM13040-51

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-13-168-17-101001

510-13-168-17-101001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3371
- +

Añadir

Investigación

510-13-168-17-101001

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-168-17-101003

510-13-168-17-101003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3322
- +

Añadir

Investigación

510-13-168-17-101003

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-168-17-105001

510-13-168-17-105001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2495
- +

Añadir

Investigación

510-13-168-17-105001

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-168-17-105002

510-13-168-17-105002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2510
- +

Añadir

Investigación

510-13-168-17-105002

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-168-17-105003

510-13-168-17-105003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3063
- +

Añadir

Investigación

510-13-168-17-105003

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-168-17-101002

510-13-168-17-101002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3787
- +

Añadir

Investigación

510-13-168-17-101002

Datasheet

Tube 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6554-16

32-6554-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3747
- +

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Investigación

32-6554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-13-169-13-000001

510-13-169-13-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3374
- +

Añadir

Investigación

510-13-169-13-000001

Datasheet

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-169-13-000002

510-13-169-13-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3630
- +

Añadir

Investigación

510-13-169-13-000002

Datasheet

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-169-13-000003

510-13-169-13-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2025
- +

Añadir

Investigación

510-13-169-13-000003

Datasheet

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-169-17-101001

510-13-169-17-101001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3235
- +

Añadir

Investigación

510-13-169-17-101001

Datasheet

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-169-17-101002

510-13-169-17-101002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2101
- +

Añadir

Investigación

510-13-169-17-101002

Datasheet

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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