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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-169-17-101003

510-13-169-17-101003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2802
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Investigación

 510-13-169-17-101003

Datasheet

 Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-352M26-001104

558-10-352M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

 3704
- +

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Investigación

 558-10-352M26-001104

Datasheet

 Bulk 558 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-500M30-001148

514-87-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

 2116
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Investigación

 514-87-500M30-001148

Datasheet

 Bulk 514 Active BGA 500 (30 x 30) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-400M20-000148

514-83-400M20-000148

CONN SOCKET BGA 400POS GOLD

Preci-Dip

 3468
- +

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Investigación

 514-83-400M20-000148

Datasheet

 Bulk 514 Active BGA 400 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-296-19-131144

614-83-296-19-131144

CONN SOCKET PGA 296POS GOLD

Preci-Dip

 2993
- +

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Investigación

 614-83-296-19-131144

Datasheet

 Bulk 614 Active PGA 296 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-352M26-001105

518-77-352M26-001105

CONN SOCKET PGA 352POS GOLD

Preci-Dip

 2560
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Investigación

 518-77-352M26-001105

Datasheet

 Bulk 518 Active PGA 352 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
24-3551-16

24-3551-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 3819
- +

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Investigación

 24-3551-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3552-16

24-3552-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 3416
- +

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Investigación

 24-3552-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6551-16

24-6551-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 3623
- +

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Investigación

 24-6551-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6552-16

24-6552-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 3866
- +

Añadir

Investigación

 24-6552-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6553-16

24-6553-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 2460
- +

Añadir

Investigación

 24-6553-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3553-16

24-3553-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 2703
- +

Añadir

Investigación

 24-3553-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3554-16

24-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

 2136
- +

Añadir

Investigación

 24-3554-16

Datasheet

 Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6508-21

40-6508-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 2569
- +

Añadir

Investigación

 40-6508-21

Datasheet

 Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-31

40-6508-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

 2438
- +

Añadir

Investigación

 40-6508-31

Datasheet

 Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
132-PGM13079-10H

132-PGM13079-10H

CONN SOCKET PGA GOLD

Aries Electronics

 2482
- +

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Investigación

 132-PGM13079-10H

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
132-PGM14015-10H

132-PGM14015-10H

CONN SOCKET PGA GOLD

Aries Electronics

 3096
- +

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Investigación

 132-PGM14015-10H

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
224-PGM15038-11H

224-PGM15038-11H

CONN SOCKET PGA GOLD

Aries Electronics

 2035
- +

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Investigación

 224-PGM15038-11H

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-87-504M29-001148

514-87-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

 2887
- +

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Investigación

 514-87-504M29-001148

Datasheet

 Bulk 514 Active BGA 504 (29 x 29) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-356M26-001104

558-10-356M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

 2331
- +

Añadir

Investigación

 558-10-356M26-001104

Datasheet

 Bulk 558 Active BGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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