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Photo Mfr. Part # Stock Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-3571-16

32-3571-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 3721
- +

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Investigación

 32-3571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-3572-16

32-3572-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 2372
- +

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Investigación

 32-3572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-3573-16

32-3573-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 2697
- +

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Investigación

 32-3573-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-3575-16

32-3575-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 2371
- +

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Investigación

 32-3575-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
558-10-356M26-001101

558-10-356M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 3765
- +

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Investigación

 558-10-356M26-001101

Datasheet

 Bulk 558 Active PGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-289-17-000002

510-93-289-17-000002

SOCKET SOLDERTAIL 289-PGA

Mill-Max Manufacturing Corp.

 3711
- +

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Investigación

 Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-289-17-000001

510-93-289-17-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3261
- +

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Investigación

 510-93-289-17-000001

Datasheet

 Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-289-17-000003

510-93-289-17-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3171
- +

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Investigación

 510-93-289-17-000003

Datasheet

 Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
209-PGM17030-11

209-PGM17030-11

CONN SOCKET PGA GOLD

Aries Electronics

 2073
- +

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Investigación

 209-PGM17030-11

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
209-PGM17046-11

209-PGM17046-11

CONN SOCKET PGA GOLD

Aries Electronics

 2853
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Investigación

 209-PGM17046-11

Datasheet

 Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-357M19-001101

558-10-357M19-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 2044
- +

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Investigación

 558-10-357M19-001101

Datasheet

 Bulk 558 Active PGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-478M26-131148

514-87-478M26-131148

CONN SOCKET BGA 478POS GOLD

Preci-Dip

 3663
- +

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Investigación

 514-87-478M26-131148

Datasheet

 Bulk 514 Active BGA 478 (26 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6570-16

32-6570-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 2181
- +

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Investigación

 32-6570-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-6571-16

32-6571-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

 3917
- +

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Investigación

 32-6571-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
32-6572-16

32-6572-16

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

 3042
- +

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Investigación

 32-6572-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6573-16

32-6573-16

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

 3461
- +

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Investigación

 32-6573-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6575-16

32-6575-16

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

 2177
- +

Añadir

Investigación

 32-6575-16

Datasheet

 Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
514-87-480M29-001148

514-87-480M29-001148

CONN SOCKET BGA 480POS GOLD

Preci-Dip

 2504
- +

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Investigación

 514-87-480M29-001148

Datasheet

 Bulk 514 Active BGA 480 (29 x 29) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-43-273-21-125002

510-43-273-21-125002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 3986
- +

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Investigación

 510-43-273-21-125002

Datasheet

 Bulk 510 Active PGA 273 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-159-16-105001

510-13-159-16-105001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

 2420
- +

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Investigación

 510-13-159-16-105001

Datasheet

 Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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